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Intelligent power modules, motor controllers and vehicles

A technology of intelligent power modules and motor controllers, which is applied in the field of vehicles, can solve the problems of unsatisfactory heat dissipation, large space occupation, and uncompact structure of IGBT modules, and achieve the effects of shortening the design and development cycle, improving heat dissipation efficiency, and saving space

Active Publication Date: 2020-03-20
BYD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, this kind of motor controller is often limited by the above-mentioned structural arrangement. Since only one surface of the IGBT module contacts the bottom plate of the box, the heat dissipation effect of the IGBT module is not ideal.
When the power of the motor is large, the IGBT module will generate a lot of heat when it works for a long time, and the temperature of the IGBT module will rise sharply. At this time, only one surface exchanges heat with the coolant in the bottom plate of the box. Unable to slow down the temperature rise of the IGBT module
[0005] In addition, in product design, after selecting a certain type of IGBT module, it is necessary to design additional matching film capacitors, IGBT drive circuit boards, radiators and other components. Therefore, research and development work usually involves electronic circuit design, structural design, Professional knowledge in multiple fields such as heat dissipation system design has very high requirements on the technical aspects and experience of designers, and the workload is very huge
In addition, when the same R&D personnel designs products with different powers, the types of IGBT modules used are different. At this time, the entire product needs to be redesigned, proofed, tested, and certified, which is very laborious and time-consuming, and the structure is not compact and takes up a lot of space.
Moreover, when producing products with different powers, the production process and production process are also different, and there are many types of raw materials for stocking, so it is necessary to find different supply resources, which greatly increases the cost

Method used

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  • Intelligent power modules, motor controllers and vehicles
  • Intelligent power modules, motor controllers and vehicles
  • Intelligent power modules, motor controllers and vehicles

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Embodiment Construction

[0031] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0032] In this disclosure, in the absence of a contrary statement, the used orientation nouns such as "above, below" refer to figure 1 (or figure 2 , Figure 5 ) of the corresponding parts "above, below", on this basis, the term "side surface" or "side" used in this disclosure refers to figure 1 The side surfaces or sides of the corresponding parts; the "length direction" and "height direction" used are respectively figure 1 (or figure 2 , Figure 5 ) in the left-right direction and the up-down direction are defined based on the reference, and are only used for explaining the present disclosure, and are not used for limitation.

[0033] According to a...

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Abstract

The present disclosure provides an intelligent power module, a motor controller and a vehicle. The intelligent power module (10) includes a power electronic device (11), a heat dissipation device for the power electronic device (11), a drive board (13) for driving the power electronic device (11), and the A capacitor (14) connected to a power electronic device (11), characterized in that the heat dissipation device includes a first radiator (12a) and a second radiator (12b), and the power electronic device (11) is clamped in Between the first heat sink (12a) and the second heat sink (12b), and the power electronic device (11) is fixed together with the first heat sink (12a) and the second heat sink (12b) The capacitor (14). The intelligent power module provided by the present disclosure not only has high heat dissipation efficiency, but also has the advantages of standardization, easy expansion and space saving.

Description

technical field [0001] The present disclosure relates to the field of vehicles, in particular, to an intelligent power module, a motor controller and a vehicle. Background technique [0002] The IGBT module is a modular semiconductor device packaged by IGBT (Insulated Gate Bipolar Transistor, ie: insulated gate bipolar transistor) and FWD (Freewheeling diode, ie: freewheeling diode chip) through a specific circuit bridge. Rectification, inverter, frequency conversion and other functions are widely used in rail transit, home appliance energy saving, wind power generation, solar photovoltaic and new energy vehicles (such as electric vehicles, etc.). [0003] Typically, in the field of electric vehicles, an IGBT module is usually provided in a motor controller to convert a direct current (DC) of a battery into an alternating current (AC) for driving a motor. Existing motor controllers generally include a box body and an IGBT module, an IGBT drive circuit board, an IGBT control...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/00H05K7/20H05K5/02
CPCH02M1/00H02P27/00H05K7/20H05K7/20218
Inventor 杨小华陈银严百强
Owner BYD SEMICON CO LTD