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Barrier control type H-shaped grid-controlled two-way tunneling transistor and manufacturing method thereof

A technology of tunneling transistors and potential barriers, which is applied in the field of barrier-regulated H-shaped gate-controlled bidirectional tunneling transistors and its manufacturing field, which can solve the problems of unidirectional switching and subthreshold swings that cannot be reduced, and achieve low subthreshold swings The effect of

Active Publication Date: 2018-03-20
宿松新驱光电科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to effectively combine and utilize the advantages of interchangeable sources and drains of MOSFETs type devices and the low subthreshold swing of ordinary tunneling field effect transistors, solve the problem that the subthreshold swing of MOSFETs type devices cannot be reduced and ordinary tunneling field effect transistors can only As the deficiency of the unidirectional switch, the present invention proposes a barrier-regulated H-shaped gate-controlled bidirectional tunneling transistor and its manufacturing method

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  • Barrier control type H-shaped grid-controlled two-way tunneling transistor and manufacturing method thereof
  • Barrier control type H-shaped grid-controlled two-way tunneling transistor and manufacturing method thereof
  • Barrier control type H-shaped grid-controlled two-way tunneling transistor and manufacturing method thereof

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Embodiment Construction

[0077] Below in conjunction with accompanying drawing, the present invention will be further described:

[0078] Such as figure 1 , figure 2 and image 3 As shown, a barrier-regulated H-shaped gate-controlled bidirectional tunneling transistor includes a silicon substrate 12 of an SOI wafer, and a substrate insulating layer 11 of the SOI wafer is above the silicon substrate 12 of the SOI wafer. Above the round substrate insulating layer 11 is a part of the monocrystalline silicon film 1, the barrier control gate 2, the gate electrode insulating layer 7, and the insulating dielectric barrier layer 13. The monocrystalline silicon film 1 has a "concave" geometric feature, For impurity concentration below 10 16 cm -3 The single crystal silicon semiconductor material, the inner surface of the groove-shaped structure formed by the single crystal silicon thin film 1 and the front and rear outer surfaces are attached with a gate electrode insulating layer 7; the heavily doped sou...

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Abstract

The invention relates to a barrier control type H-shaped grid-controlled two-way tunneling transistor and a manufacturing method thereof. The barrier control type H-shaped grid-controlled two-way tunneling transistor provided by the invention comprises an H-shaped grid electrode, a barrier adjusting grid and a bilaterally symmetric structure. The tunneling transistor is strong in grid control capability and a metal source / drain interchangeable region can be controlled as a source region or a drain region through adjusting the electrode voltage of the source / drain interchangeable region. In this way, the direction of the tunneling current is changed. The invention has the advantages of low static power consumption, reverse leakage current, strong grid control capability, low sub-threshold swing and bidirectional switching function. Compared with a common MOSFET type device, more excellent switching characteristics are achieved through the tunneling effect. Compared with a common tunneling field effect transistor, source / drain interchangeable bidirectional symmetrical switching characteristics, which cannot be realized by the common tunneling field effect transistor, can be realizedby the above tunneling transistor. Therefore, the tunneling transistor is suitable for popularization and application.

Description

technical field [0001] The invention relates to the field of ultra-large-scale integrated circuit manufacturing, in particular to a low-leakage barrier-regulated H-shaped gate-controlled bidirectional tunneling transistor suitable for low-power integrated circuit manufacturing and a manufacturing method thereof. Background technique [0002] According to the requirements of Moore's law, the basic unit MOSFETs of integrated circuits will become smaller and smaller in size, which will not only increase the difficulty of the manufacturing process, but also cause various adverse effects to become more prominent. Due to the limitations of the physical mechanism of current generation in the MOSFETs used in IC design today, the subthreshold swing cannot be lower than 60mV / dec. When the ordinary tunneling field effect transistor is used as a switching device, the tunneling effect of carriers between the semiconductor energy bands is used as the conduction mechanism of the current, a...

Claims

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Application Information

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IPC IPC(8): H01L29/08H01L29/423H01L29/739H01L21/331H01L21/28
CPCH01L29/0843H01L29/42312H01L29/66356H01L29/7391
Inventor 靳晓诗马恺璐刘溪
Owner 宿松新驱光电科技有限公司
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