Pasting process of polyimide film on the surface of honeycomb structure board

A technology of polyimide film and honeycomb structure, applied in lamination auxiliary operations, chemical instruments and methods, lamination, etc., can solve problems such as poor bonding performance, failure of commercial satellites, insufficient bonding strength, etc., and achieve reduction The effect of production cost, improvement of curing efficiency, and good paste quality

Active Publication Date: 2019-10-25
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although vacuum curing is adopted in this method, some air bubbles between the honeycomb structure plate and the polyimide film will be eliminated to a certain extent, but since the glue coating and polyimide film paving treatment in this method are both Under normal temperature and pressure, the tiny air bubbles between the honeycomb structure board and the polyimide film cannot be effectively eliminated, and the complete removal of air bubbles has a significant relationship with the degree of vacuum, the time of putting it into the vacuum box, and the curing temperature. If It is difficult to completely remove the tiny air bubbles between the honeycomb structure board and the polyimide film simply by vacuum curing
In fact, these tiny bubbles are difficult to detect with the naked eye under normal pressure, and since commercial satellites are usually used in space environments with high and low temperature cycles, vibrations, high-energy particle radiation, etc., any tiny bubbles that exist The risks will be magnified, causing the polyimide membrane to expand and fall off, reducing the service life of commercial satellites and eventually causing commercial satellites to fail rapidly in space
As another example, the Chinese patent document with the publication number CN106587931A discloses a method for pasting polyimide films on the surface of a honeycomb sandwich structure on a grid surface. By scraping off the glue, the bonding process is optimized to make up for the air holes in the traditional bonding method. defects, but this pasting method also cannot eliminate the hidden danger of air bubbles between the honeycomb structure board and the polyimide film
In addition, in the existing process of pasting polyimide film on the outer surface of commercial satellite honeycomb structure board, only the honeycomb structure board is cleaned, and the polyimide film is not pre-surface treated. The wettability is not good, and the bonding performance is poor. If it is directly pasted on the surface of the honeycomb structure board, there will be problems such as insufficient bonding strength and easy falling off. In the space environment, the risk of the polyimide film falling off from the honeycomb structure board is greater. For example, in the pasting method disclosed in the Chinese patent literature with the publication number CN106587931A, the honeycomb structure board is only surface treated, and the polyimide film is not treated. As a result, the polyimide film is difficult to meet the bonding strength of the solar cell array on the surface of the commercial satellite honeycomb structure board, so it is difficult to guarantee the service life of the commercial satellite
Therefore, how to comprehensively improve the problem of hidden bubbles between the honeycomb structure board and the polyimide film existing in the prior art, and the problem that the bonding strength of the polyimide film is not enough and easy to fall off, and provide a method that can remove the air bubbles completely , and the pasting process of the polyimide film on the surface of the honeycomb structure plate that can improve the paste quality is of great significance for improving the service life of commercial satellites and expanding the application range of commercial satellites

Method used

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  • Pasting process of polyimide film on the surface of honeycomb structure board
  • Pasting process of polyimide film on the surface of honeycomb structure board

Examples

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Effect test

Embodiment 1

[0036] A kind of pasting process of polyimide film on the surface of honeycomb structure board, its pasting process is as follows figure 1 shown, including the following steps:

[0037] (1) Pretreatment of polyimide membrane:

[0038] (1.1) Alkali treatment: put the polyimide film with a thickness of 50 microns in pure water for 15 minutes, and then soak it in a sodium hydroxide solution with a concentration of 2mol / L at 40°C. Lye treatment was carried out for 20 minutes.

[0039] (1.2) Cleaning: Wash the polyimide membrane obtained after the lye treatment in step (1.1) with pure water until the pH value of the washing solution is neutral, then clean it with tetrahydrofuran, acetone, and alcohol in sequence, and let it dry in the air. Dry. According to the observation of microscopic morphology, the surface corrosion depth of the polyimide film was about 500 nanometers after the alkali treatment, and a nano-velvet surface was formed on the surface, showing a nano-velvet stru...

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Abstract

The invention discloses a technology for pasting a polyimide film on the surface of a honeycombed plate. The technology comprises the following steps: laying the polyimide film on an adhesive on the surface of the honeycombed plate, standing the polyimide film and the honeycombed plate, performing uniform-speed vacuumizing, keeping the stability of the vacuum degree and applying a pressure to thesurface of the honeycombed plate, and performing heat-curing to complete the pasting of the polyimide film. The time window of the adhesive having a large viscosity and low fluidity when being surface-dry and the uniform gas flow uniform-speed vacuumizing are used to effectively remove bubbles between the honeycombed plate and the polyimide film without flowing and overflowing of the adhesive during air extraction, so the good pasting quality is guaranteed; the pressure is applied to the surface of the honeycombed plate to accelerate the removal of the bubbles, so the bubble removal efficiencyis improved, and the bonding strength is improved; and curing is performed under vacuum, pressurizing and heating conditions, so the bubbles are effectively prevented from infiltrating the internal of the polyimide film again, the curing is accelerated, the curing efficiency is increased, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the field of insulation treatment of honeycomb panels used in commercial satellite solar cell arrays, and relates to a bonding process of polyimide films on the surface of honeycomb structure panels. Background technique [0002] Commercial satellites have the characteristics of short development time, few test items, fast development cycle, small satellite size, and fast launch into the sky. Although commercial satellites are small, their internal structure and functions are similar to those of large satellites, and some places are even more difficult to design. Solar cell arrays are arranged on the outer surface of the honeycomb structure board of the satellite to provide energy. Arranging solar cell arrays on the outer surface of the honeycomb structure panels of commercial satellites requires that the solar cells and the honeycomb structure panels maintain a high degree of insulation, so it is necessary to paste a layer of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12B32B37/10B32B37/06B32B38/16B32B38/00
CPCB32B37/06B32B37/10B32B37/1284B32B38/00B32B38/162B32B2037/1253B32B2038/0052
Inventor 唐荣张建国杨晓生周洪彪姬常晓黄齐鸣
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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