Heat transfer structure, its manufacturing method and its heat dissipation method
A technology of manufacturing method and heat dissipation method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of affecting the heat dissipation effect, large thermal expansion coefficient, and no metal heat-conducting layer, etc., and achieve the goal of improving the blocking phenomenon Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0038] Based on the above technical features, the main beneficial effects of the heat transfer structure, its manufacturing method and heat dissipation method of the present invention can be clearly presented in the following embodiments.
[0039] Please refer to the first embodiment of the heat transfer structure of the present invention figure 1 and figure 2 As shown, it includes: a microporous plate 1 with a plurality of through-holes 11 that can generate capillary action, the diameter of the through-holes 11 is between 10 microns and 90 microns, and the cross-section of the through-holes 11 is an hourglass shape, and the section of the through hole 11 can also be an upright triangle (please refer to image 3 ) or other shapes, which are not limited; a metal heat-conducting layer 2 has a first contact surface 21 and a second contact surface 22, and the first contact surface 21 is used to contact a surface 12 of the microporous plate 1 , the surface 12 is a rough surface ...
PUM
Property | Measurement | Unit |
---|---|---|
melting point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com