A method for optimizing the return loss of bga solder joints

Abstract

The invention discloses a method for optimizing BGA (Ball Grid Array) welding spot return loss. The method includes the steps: 1) establishing a BGA welding spot signal integrity analysis model; 2) acquiring return loss of a BGA welding spot; 3) determining an influence factor of the BGA welding spot signal integrity; 4) determining a parameter level value of the influence factor of the BGA welding spot signal integrity; 5) acquiring simulation experiment samples; 6) acquiring a functional relation between the influence factor and the return loss; 7) performing variance analysis; 8) determining the correctness of the functional relation; 9) generating an initial population; 10) acquiring a current evolution generation gen and an optimal fitness value; 11) performing interlace operation onthe population; 12) performing mutation operation on the population; 13) performing evolution reversion on the population; 14) selecting an optimal individual; and 15) performing re-determination after the population is updated. The method uses a response surface method and a genetic algorithm to optimize BGA welding spot return loss, has excellent robust Performance, and is simple in calculationprocess.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging signal integrity, in particular to a method for optimizing the return loss of ball grid array (BallGrid Array, BGA for short) solder joints. Background technique [0002] As people's demand for miniaturization, functionalization, and high integration of electronic products continues to increase, high-speed circuit systems are more and more widely used, and the trend of high-frequency signal frequencies is becoming more and more obvious. The rapid development of high-speed and high-frequency electronic circuit technology has made the signal integrity problem a bottleneck in electronic design, and it is also a problem that needs to be solved urgently. Signal integrity refers to all problems caused by interconnect lines in high-speed products. Signal integrity problems will lead to misjudgment or loss of some data. In serious cases, it will cause the performance of the entire syste...

AI Technical Summary

Problems solved by technology

Signal integrity problems will lead to misjudgment or loss of some data. In severe cases, it will cause the performance of the entire system to decline, or even not work properly at all.

In addition to ensuring the mechanical connection, the solder joints as the interconnection points of the high-speed circuit system must also ensure the correct transmission of current and signals. Under high-speed and high-frequency conditions, if the correct transmission of signals in the solder joints cannot be guaranteed, it will cause the entire system Degradation of performance Therefore, it has become a new challenge to ensure that the solder joints maintain good signal transmission and do not experience signal integrity problems that lead to system failure

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