Method for preparing full-color stacked epitaxial Micro-LED upside-down-mounted array

Abstract

The invention, which belongs to the technical field of the semiconductor, provides a method for preparing a full-color stacked epitaxial Micro-LED upside-down-mounted array. The full-color stacked epitaxial Micro-LED upside-down-mounted array comprises a substrate with an electrode, a conductive substrate, a micro-isolation structure, and a stacked three-color light-emitting unit. The micro-isolation structure is a SiO2 or SiNx grid-like micro-isolation structure prepared on the conductive substrate; and the conductive substrate is exposed in the grid and is used as an epitaxial window. Epitaxy of red, green, and blue light-emitting units is carried out on the same epitaxial substrate; a micro two-dimensional matrix is formed by using a chip ICP etching technology; and then with a mature upside-down-mounted welding technology, an Micro-LED array is transferred to a substrate with a p side electrode, so that the good cooling effect is realized, the luminous efficiency of the Micro-LED is improved, and high anode single-point controllability of each Micro-LED is realized. The dimension of each light-emitting unit can be minimized; and a problem that the screen resolution is low because of the large dimension of the single light-emitting unit is solved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a method for preparing a red, green and blue full-color stacked epitaxial Micro-LED flip-chip array. Background technique [0002] The full-color LED display is usually assembled by RGB three primary colors (red, green, blue) light-emitting units in a certain arrangement, and displays rich colors, high saturation, and high display frequency by controlling the light-emitting units of each group. image. However, the production process of full-color LED display screens is very cumbersome. Usually, tens of thousands of LED light sources need to be embedded on the display panel. The requirements for the consistency of wavelength, life and efficiency of each LED are very high, resulting in high production costs. The production efficiency is low, which leads to the low reliability of the final LED display and greatly reduces it. Moreover, the final size of the LED d...

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Problems solved by technology

In addition, the packaging structure of existing Micro-LED arrays mostly uses ceramic substrates or silicon substrates for batch transfer processing. After the transfer, it is necessary to perform wire bonding on the p side of each LED. Due to the small size of Micro-LEDs, the wire bonding process It is easy to have false welding or disconnection in the

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