LED packaging method

Abstract

The invention relates to an LED packaging method. The method comprises the following steps of selecting an ultraviolet lamp wick; welding the ultraviolet lamp wick on a substrate through the reflow soldering process; coating silica gel on the ultraviolet lamp wick and the substrate to prepare a multilayer lens layer, and completing the LED packaging process. By adopting the LED packaging method, through preparing the multilayer lens layer, the refractive index is sequentially increased, so that the light transmittance of the LED lamp wick can be improved. Therefore, more light emitted by the LED lamp wick can be irradiated out through packaging materials.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to an LED packaging method. Background technique [0002] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. This is a great leap in the history of human lighting since gas lighting, incandescent lamps and fluorescent lamps, and has rapidly improved the lighting quality of human life. [0003] In recent years, LEDs mostly use the method of ultraviolet wick and RGB three primary colors to generate white light to realize lighting. This method has the following problems. First of all, the light emitted by the L...

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Problems solved by technology

First of all, the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, which leads to insufficient illumination brightness of the light source, and generally requires secondary shaping through an external lens to meet the lighting needs of specific occasions, thus increasing production costs; secondly , only a part of the energy in the LED input power is converted into light energy, and the rest of the energy is converted into heat energy. Therefore, for LED chips, especially LED chips with high power density, how to control their energy is a key issue for LED manufacturers and lamps. Finally, because high-power LEDs are used in lighting and other occasions, cost control is very important, and the structural size of the external heat sink of high-power LED lamps is not allowed to be too large, and it is impossible to allow active cooling by adding electric fans, etc. The safe junction temperature of the LED chip should be within 110°C. If the junction temperature is too high, it will lead to a series of problems such as reduced light intensity, spectral shift, increased color temperature, increased thermal stress, and accelerated aging of the chip, which greatly reduces the performance of the LED chip. At the same time, it can also lead to accelerated aging of the encapsulation glue filled on the chip, affecting its light transmission efficiency

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