Vertical transition structure

Abstract

The invention provides a vertical transition structure which comprises a radio frequency coaxial connector and a microwave multilayer printed board. The microwave multilayer printed board is composedof a first grounding plane, a strip line layer, a second grounding plane and a third grounding plane from top to bottom. A vertical transition blind hole is arranged between the first grounding planeand the strip line layer. The radio frequency coaxial connector is arranged on the first grounding plane, and the inner conductor thereof extends downward into the vertical transition blind hole and does not exceed the depth of the vertical transition blind hole. The second grounding plane layer is added with an opening directly facing the area of the vertical transition blind hole. The vertical transition structure provided by the invention has the advantages of full shielding, high reliability and wide working frequency band.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to a design method of a vertical transition structure. Background technique [0002] In recent years, with the continuous development of mobile communication and electronic countermeasures in the direction of miniaturization, low cost, high frequency, and high performance, higher requirements have been put forward for high-performance and high-reliability vertical transition transmission in the microwave and millimeter wave bands. At present, the vertical transition interconnection between the RF coaxial connector and the microwave multilayer printed board in microwave products mainly includes figure 1 , 2 Two ways are shown. [0003] (1) figure 1 The inner conductor of the medium-frequency coaxial connector passes through the vertical transition hole formed by the back-drilling process of the microwave multilayer printed board, and is soldered on the ba...

AI Technical Summary

Problems solved by technology

However, the contact area between the conductor in the connector and the pad of the vertical transition via is small, and the reliability is poor; in addition, there is a large parallel parasitic plate capacitance between the vertical transition of the stripline and the ground plane of the stripline, which is just in line with the vertical The parasitic series inductance of the transition vias forms an equivalent LC low-pass filter structure, which makes the transmission performance of the millimeter wave frequency band poor, does not meet the high performance transmission requirements of the millimeter wave, and has relatively large application limitations.

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