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Manufacturing printed circuit boards using UV free radical curable inkjet inks

A technology of printed circuit boards and inkjet inks, which is applied in the fields of printed circuits, printed circuits, and printed circuit manufacturing, and can solve problems such as unreliable inkjet printing and poor scratch resistance

Inactive Publication Date: 2018-03-27
AGFA GEVAERT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two measures result in poor scratch resistance and / or uneconomical inkjet printing which is unreliable in an industrial environment

Method used

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  • Manufacturing printed circuit boards using UV free radical curable inkjet inks
  • Manufacturing printed circuit boards using UV free radical curable inkjet inks
  • Manufacturing printed circuit boards using UV free radical curable inkjet inks

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0278] This example illustrates the effect of the type of silane compound on the adhesion of UV radical curable inkjet inks according to the invention to polyimide substrates.

[0279] Preparation of inkjet ink

[0280] A concentrated white pigment dispersion, DISP-W, having the composition shown in Table 5 was prepared.

[0281] table 5

[0282] wt% of the following components

DISP-W

Kemira TM RDI-S

50.0

DB162

4.0

INHIB

1.0

VEEA

45.0

[0283] Concentrated white pigment dispersion DISP-W by means of DISPERLUX equipped TM In a container of a dispenser (from DISPERLUXS.A.R.L., Luxembourg) mix 1500 g of white pigment Kemira in VEEA as liquid medium TM A 30% solution of RDI-S, 30 g of the inhibitor INHIB and 400 g of the polymeric dispersant DB162 in VEEA for 30 minutes was prepared. This mixture is then obtained in DYNO from WAB Willy A. Bachofen Company (Switzerland) TM - Milled with 0.40 mm yttrium-stabilized z...

Embodiment 2

[0299] This example illustrates the effect of the concentration of silane compounds on the adhesion of UV radically curable inkjet inks according to the invention to polyimide substrates.

[0300] Preparation of inkjet ink

[0301]Concentrated white pigment dispersion Disp-W was used to prepare UV radical curable white inkjet inks COMP-11 to COMP-13 and INV-7 to INV-13 according to Table 9 and Table 10.

[0302] Table 9

[0303] Component wt%

COMP-11

INV-7

INV-8

INV-9

INV-10

Disp-W

26.00

26.00

26.00

26.00

26.00

VEEA

32.56

31.56

30.06

27.56

25.56

TMPTA

18.50

18.50

18.50

18.50

18.50

DTMPTA

13.00

13.00

13.00

13.00

13.00

INHIB

0.69

0.69

0.69

0.69

0.69

Ebecryl TM 1360

0.30

0.30

0.30

0.30

0.30

BAPO

3.00

3.00

3.00

3.00

3.00

TPO

2.95

2.95

2.95

2.95

2.95

Escure TM KIP I...

Embodiment 3

[0313] This example illustrates the suitability of a UV radical curable white inkjet ink according to the invention for the manufacture of Flex PCBs.

[0314] Evaluation and Results

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Abstract

A manufacturing method for printed circuit boards (1, 10) including the steps of: a) inkjet printing a UV free radical curable inkjet ink on a substrate (2); b) UV curing the UV free radical curable inkjet ink on the inkjet printed substrate; and c) applying a thermal treatment on the UV cured inkjet printed substrate; wherein the UV free radical curable inkjet ink contains at least a colorant, afree radical photoinitiator; a duofunctional monomer or oligomer and a polyfunctional monomer or oligomer; and 1 to 15 wt% of a silane compound according to Formula (I), wherein, the linking group L represents a -CH2- group or an aliphatic chain having 2 to 10 carbon atoms optionally substituted in the aliphatic chain by a nitrogen or an oxygen; R1 represents a methoxy group; R2 and R3 independently represent a methoxy group or a C1- to C4-alkyl group; and R4 represents a functional group selected from the group consisting of an epoxy group, an amine group, a carbamate group, a trimethoxy silane group and an ureido group.

Description

technical field [0001] The present invention relates to a method of manufacturing printed circuit boards (PCBs), in particular flexible printed circuits (Flex PCBs), using UV curable inkjet inks. Background technique [0002] Traditionally, printed circuit boards are manufactured by photolithography. Later, inkjet technology has been applied to the manufacture of PCBs due to the flexibility of its use, such as the ability to print variable data, and due to the increased reliability it allows for incorporation into production lines. UV curable inkjet inks are particularly preferred because high quality color images can be printed on non-absorbent ink receivers, such as plastic materials. For example, WO 2013 / 113572 (AGFA) discloses UV-curable etch-resistant inkjet inks for producing conductive copper patterns on printed circuit boards. [0003] Flex PCB is a patterned arrangement of printed circuits and components utilizing a flexible substrate with or without a flexible pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28C09D11/101
CPCC08F290/068C08G18/672C08G18/807C09D11/101C09D11/322H05K1/0393H05K3/287H05K2201/0154H05K2203/013H05K2203/097
Inventor R.托夫斯G.坎特罗J.洛库菲尔H.范阿尔特
Owner AGFA GEVAERT AG