Nano-patterned substrate and manufacturing method thereof
A patterned substrate and manufacturing method technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high temperature growth, lattice mismatch, etc.
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[0012] The specific implementation of this patent will be described in detail below in conjunction with the accompanying drawings. It should be pointed out that this specific implementation is only an example of the preferred technical solution of this patent, and should not be understood as limiting the scope of protection of this patent.
[0013] A method for producing a nanoscale patterned substrate is provided in this specific embodiment, and the method includes the following steps:
[0014] Step 1, first sputtering an AlN layer in the thickness range of 10-800nm on the sapphire plane substrate.
[0015] In this step, a sputtering device is firstly used to grow an AlN layer on the sapphire substrate. The sputtering equipment is preferably used, for example, iTopsA230 aluminum nitride sputtering system, the sputtering temperature of the equipment is 800°C, the high vacuum is on the order of 10-8torr, and 19 pieces of 2-inch sapphire substrates can be sputtered each time. ...
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