BGA repair method, apparatus and system

A device pairing and rework station technology, applied in printed circuit repair/correction, printed circuit secondary treatment, post-manufacturing process, etc., can solve problems such as high temperature expansion, affecting BGA chip reliability and life, BGA high temperature bubbles, etc., to achieve Reduce the impact, improve the efficiency of rework work, improve the life and reliability of the effect
CN107864567AInactive Publication Date: 2018-03-30GUANGDONG VTRON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GUANGDONG VTRON TECH CO LTD
Publication Date
2018-03-30
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a BGA repair method, apparatus and system. The repair method comprises the steps of performing heating treatment on a BGA on a fault board card to detach the BGA from the faultboard card to obtain a to-be-processed BGA; performing printing treatment on the to-be-processed BGA by tin paste to obtain a printed BGA; and putting the printed BGA on a PCB bonding pad which is subjected to de-tinning treatment in advance and corresponding to the printed BGA, so as to perform welding treatment on the printed BGA and the PCB bonding pad to complete BGA repair operation. By virtue of the BGA repair method disclosed in the invention, number of times of high-temperature treatment on the BGA chip can be reduced, thereby lowering influence of a high temperature to the BGA chip,and dramatically prolonging the service life and improving reliability of the BGA chip.
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Description

technical field

[0001] The invention relates to the technical field of PCB technology, in particular to a BGA rework method, device and system. Background technique

[0002] However, with the miniaturization of electronic products, these common packaged components are far from meeting the needs of product design, so a large number of BGA (Ball Grid Array, that is, solder ball array packaging) appear in products, which are placed on the package substrate An array of solder balls is made at the bottom as the I / O terminal of the circuit to be interconnected with a PCB (Printed Circuit Board, ie a printed circuit board). In the SMD (Surface Mounted Devices, surface mount device) process, due to various reasons, there are always some defects, such as empty soldering, short circuit, etc., so it is inevitable that there will be maintenance. For ordinary SMD components, such as chip resistors, chip capacitors, etc., maintenance is relatively easy, and there is basically no need to ...

Claims

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