High-efficiency heat radiator for closed-structure high-heat flux device

A technology with high heat flux density and heat sink, applied in electric solid devices, semiconductor devices, semiconductor/solid state device components, etc., can solve problems such as inability to meet thermal design indicators, pipeline connection, increased energy consumption, etc., and reach the limit of high efficiency High heat dissipation capacity, high thermal conductivity, and not easy to leak

Active Publication Date: 2018-04-06
SICHUAN JIUZHOU ELECTRIC GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The simple use of forced air cooling can no longer meet the thermal design indicators, and the traditional liquid cooling solution needs to fix the heating device on the liquid cooling cold plate, and the heat can be effectively taken away by the liquid flow
However, the space constraints of secondary cooling equipment required by traditional liquid cooling often become its restrictive design factor, and it also brings about increased energy consumption at low temperatures and problems in the connection between traditional liquid cooling sources and equipment.

Method used

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  • High-efficiency heat radiator for closed-structure high-heat flux device
  • High-efficiency heat radiator for closed-structure high-heat flux device
  • High-efficiency heat radiator for closed-structure high-heat flux device

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with accompanying drawing.

[0029] First, if figure 1 As shown, it provides a working principle diagram of a high-efficiency radiator for devices with a closed structure and high heat flux density in the present invention. The working principle of the present invention is: the liquid metal pipe 12 forms a circuit and is filled with liquid metal, and the liquid metal pipe 12 is provided with a heat absorbing device 11 for absorbing the heat of the heat generating device inside the closed structure, for driving the liquid metal to flow The drive pump 2 and the cooling fins 13 and cooling plates 14 for cooling the liquid metal. When the liquid metal in the liquid metal pipeline 12 absorbs heat from the heat absorbing device 11 , the cooling fins 13 and the cooling plate 14 jointly dissipate heat from the liquid metal. In addition, one side of the heat dissipation fins 13 and the heat dissipation plate ...

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Abstract

The invention provides a high-efficiency heat radiator for a closed-structure high-heat flux device, which comprises a liquid metal pipeline and heat radiation fins, wherein the liquid metal pipelinepasses through the heat radiation fins; and the liquid metal pipeline is filled with liquid metal capable of flowing. A driving pump is also included, and the driving pump is arranged on the liquid metal pipeline for driving the liquid metal in the liquid metal pipeline to flow. A liquid metal self-circulating cold plate is made by adopting a processing mode such as overall casting or welding, a heat absorption device, a heat radiation plate, the heat radiation fins and the liquid metal pipeline are integrated, the heat resistance of the system is reduced to the most extent, and the heat conduction efficiency is high; and the heat conductivity of the liquid metal is much higher than that of water, air and multiple non-metallic media, and thus, the liquid metal heat radiator can achieve more efficient heat transport and extreme heat radiation ability than traditional water cooling.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a new high-efficiency radiator with low energy consumption, small volume and high reliability, which integrates liquid metal, a forced air cooling device, a driving pump and an integrated cold plate. Background technique [0002] At present, with the improvement of the functions of electronic equipment, the integration and heat flux density of its devices are also significantly improved. The simple use of forced air cooling can no longer meet the thermal design specifications, and the traditional liquid cooling solution needs to fix the heating device on the liquid cooling cold plate, and the heat can be effectively taken away by the liquid flow. However, the space constraints of secondary cooling equipment required by traditional liquid cooling often become its restrictive design factor, and it also brings about increased energy consumption at low temperatur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/367H01L23/467
CPCH01L23/3672H01L23/467H01L23/473
Inventor 李丽丹张庆军
Owner SICHUAN JIUZHOU ELECTRIC GROUP
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