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Light source assembly, display device and preparing method of light source assembly

A technology of light source components and fluorescent layers, which is applied to the components of lighting devices, identification devices, lighting devices, etc., can solve the problems that display devices are difficult to achieve full screen and light and thin, and achieve high production yield and low power consumption. Strong promotional effect

Inactive Publication Date: 2018-04-13
SHENZHEN LT OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to overcome the problem that the existing display device is difficult to achieve a full screen and light and thin, the present invention provides a light source component, a display device and a preparation of the light source component

Method used

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  • Light source assembly, display device and preparing method of light source assembly
  • Light source assembly, display device and preparing method of light source assembly
  • Light source assembly, display device and preparing method of light source assembly

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Embodiment Construction

[0055] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0056] see figure 1 The first embodiment of the present invention provides a light source assembly 10, wherein the light source assembly 10 includes a carrier 11 and a plurality of LED chips 12 uniformly arranged on the carrier 11, the light source assembly 10 further includes a light uniform layer 11, The same uniform light layer 13 is arranged on the plurality of LED chips 12 . The light emitted by the LED chip 12 directly enters into the homogeneous layer 13 for scattering, forming a continuous and uniform light emitting surface. The area of ​​the light-emitting surface is equ...

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Abstract

The invention provides a light source assembly, a display device and a preparing method of a light source assembly. The light source assembly is characterized in that a carrier comprises two superposed film layers and a conductive layer between the two superposed film layers; the conductive layer comprises a plurality of pad patterns; the pad patterns are electrically connected through leads; onefilm layer is provided with a plurality of windows for exposing the pad patterns; LED chips are fixed on different pad patterns correspondingly through tin soldering; and the same fluorescent layer fills the clearances among the LED chips and covers all LED chips. Compared with a traditional backlight source, the light source assembly and the preparing method thereof according to the invention have advantages of ensuring high light emitting effect, realizing high flexibility and foldability of the light source assembly for matching preparation of a narrow-frame and even no-frame display device. Compared with an existing popular OLED screen, the display device according to the invention can realize a substitution plan with advantages of low cost, high yield and high popularization value forrealizing high screen-to-body ratio.

Description

【Technical field】 [0001] The invention relates to the field of LED display, in particular to a light source component, a display device and the preparation of the light source component. 【Background technique】 [0002] LED (Light Emitting Diode) is an existing common solid-state light source, which has the characteristics of long life, high stability, energy saving and environmental protection. Existing LED display screens generally package a plurality of LED chips on a circuit board. No matter whether it adopts side-type lighting or direct-light lighting, the existing LED light source has a surrounding frame or a closed structure so that all The above-mentioned fluorescent glue is formed on the LED chip by coating, but such a preparation process often needs to set a light reflection area at the edge of the LED light source, so that the LED light source has an uneven luminous effect and needs to set a structure such as a reflective plate to To achieve the effect of uniform ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50H01L33/58H01L33/60H01L33/62
CPCF21V23/06G02F1/133603G02F1/133606G02F1/133609G02F1/133611G09F9/33G09G3/32G02F1/133607G02F1/133614H01L25/0753H01L33/48H01L33/50H01L33/504H01L33/505H01L33/507H01L33/58H01L33/60H01L33/62H01L2933/0033H01L2933/0041H01L2933/0058H01L2933/0066G02F1/133608G02F1/133612
Inventor 王磊
Owner SHENZHEN LT OPTOELECTRONICS CO LTD
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