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Small-sized electronic component and method for preparing the same

A technology of electronic components and small size, applied in the field of small size electronic components and their preparation, can solve the problems of product sagging, surface tension increase, electronic components sagging, etc., and achieve the effect of solving product sagging

Inactive Publication Date: 2018-04-17
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, the purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a method for preparing small-sized electronic components, so as to solve the problem that electronic components such as 0201, 01005, and copper soft terminal paste are easily damaged during the sealing process. There is a problem of sagging, so as to further improve product quality
[0007] In the present invention, before the electronic components are subjected to the capping process, plasma hydrophobic treatment is performed on the surface of the electronic components to make the surface of the electronic components reach a hydrophobic state. After the plasma hydrophobic treatment, the surface of the electronic components is in a hydrophobic state, and its surface tension becomes larger. Even The end slurry with low viscosity is not easy to flow, so as to solve the problem of product sagging

Method used

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  • Small-sized electronic component and method for preparing the same

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Embodiment 1

[0029] An embodiment of the small-sized electronic component of the present invention, the small-sized electronic component described in this embodiment is a multilayer ceramic capacitor, which is specifically prepared by the following method:

[0030] (1) The process before the chamfering is all carried out according to the conventional process of the existing multilayer ceramic capacitor;

[0031] (2) Chamfering process: Use a certain amount of tap water, quartz sand, and alumina powder to mix and pack in a planetary grinder for grinding (rotation speed 120rpm, time 240min), then sieve to remove aluminum powder, quartz sand, wash and dry ;

[0032] (3) Plasma treatment process: said plasma process is realized by plasma equipment, and said plasma equipment is the PCT plasma 0531 product of Korea MAK company, and concrete structural drawing is as attached image 3 As shown, the specific working principle diagram is attached Figure 4 As shown, the specific plasma process is ...

Embodiment 2

[0035] An embodiment of the small-sized electronic component of the present invention, the small-sized electronic component described in this embodiment is a multilayer ceramic capacitor, which is specifically prepared by the following method:

[0036] (1) The process before the chamfering is all carried out according to the conventional process of the existing multilayer ceramic capacitor;

[0037] (2) Chamfering process: Use a certain amount of tap water, quartz sand, and alumina powder to mix and pack in a planetary grinder for grinding (speed 210rpm, time 120min), then sieve to remove aluminum powder, quartz sand, wash, and dry ;

[0038] (3) Plasma treatment process: said plasma process is realized by plasma equipment, and said plasma equipment is the PCT plasma 0531 product of Korea MAK company, and concrete structural drawing is as attached image 3 As shown, the specific working principle diagram is attached Figure 4 As shown, the specific plasma process is as follows...

Embodiment 3

[0041] An embodiment of the small-sized electronic component of the present invention, the small-sized electronic component described in this embodiment is a multilayer ceramic capacitor, which is specifically prepared by the following method:

[0042] (1) The process before the chamfering is all carried out according to the conventional process of the existing multilayer ceramic capacitor;

[0043] (2) Chamfering process: Use a certain amount of tap water, quartz sand, and alumina powder to mix and pack in a planetary grinder for grinding (rotation speed 170rpm, time 180min), then sieve to remove aluminum powder, quartz sand, wash and dry ;

[0044] (3) Plasma treatment process: said plasma process is realized by plasma equipment, and said plasma equipment is the PCT plasma 0531 product of Korea MAK company, and concrete structural drawing is as attached image 3 As shown, the specific working principle diagram is attached Figure 4 As shown, the specific plasma process is ...

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Abstract

The invention discloses a method for preparing a small-sized electronic component. The method comprises: before blocking processing is carried out on an electronic component, plasma processing is carried out on the surface of the electronic component. Because plasma hydrophobic treatment is carried out on the surface of the electronic component before blocking processing of the electronic component, the surface of the electronic component reaches a good hydrophobic state. After the plasma hydrophobic treatment, the surface of the electronic component is in a hydrophobic state and the surface strain is enhanced, so that even the end slurry with the low viscosity can not flow on the surface and thus the product sagging problem is solved. Meanwhile, the invention also discloses an electroniccomponent prepared by the preparation method.

Description

technical field [0001] The invention relates to an electronic component and a preparation method thereof, in particular to a small-sized electronic component and a preparation method thereof. Background technique [0002] After decades of development and evolution of multilayer ceramic capacitors, the thickness of its single-layer dielectric has dropped from tens of microns to a few tenths of a micron today, and its size has gradually developed from the initial 1206 to the current 0201 and 01005. Particles, in the same industry as MLCC, it takes about 3 years for process improvement and equipment development every time the product size is reduced by one size. Not good, it is easy to make the terminal electrode larger, so the product size becomes larger, the slurry leveling property is too good, and it is easy to sag, because the small size product itself has a small distance between the positive and negative electrodes, the sagging is easy to cause poor appearance and poor c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224H01G4/30H01G4/12
CPCH01G4/224H01G4/12H01G4/30
Inventor 周锋刘新陈长云伍尚颖黄永强谢忠
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG