Liquid metal fluid containing phase-change microcapsules

A phase change microcapsule and liquid metal technology, applied in the field of cooling fluids, can solve the problems such as the inability to meet the thermal control requirements of high heat flux chips

Inactive Publication Date: 2010-07-14
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, traditional cooling methods such as air cooling (Zhang Qianshan, patent: computer CPU radiator, application number: 01130819.2), water cooling (Zhu Yuru, patent: CPU...

Method used

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  • Liquid metal fluid containing phase-change microcapsules
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  • Liquid metal fluid containing phase-change microcapsules

Examples

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Embodiment 1

[0023] The liquid metal 2 used as a solvent is mercury (melting point -38.72°C), gallium (melting point 29.8°C), gallium-indium alloy (such as 62.5wt% Ga, 21.5wt% In, 16wt% Sn, melting point 10.7°C); or Is other metals with low melting points at medium or low temperatures, including lead (melting point 327.5°C), bismuth (melting point 271.4°C), tin (melting point 232.0°C) or chromium (melting point 321.1°C); or forms of at least two of the above metals alloys, or alloys of the above metals with other metals. The ratio of the composition in the liquid alloy can be selected according to actual needs, so that the melting point of the alloy is lower than the working temperature.

[0024] The phase change material 3 has a very high phase change heat, and can be selected from solid-liquid or liquid-gas hydrated inorganic salts, higher fatty alcohols, higher fatty acids, hydrocarbons, polyethers, aliphatic polyesters and polyester ethers, etc. The heat of phase change per unit weigh...

Embodiment 2

[0026] The phase-change material 3 of the present invention is a combination of two or more of the above-mentioned phase-change materials, forming phase-change microcapsules 1 with multiple phase-change temperatures, and realizing enhanced heat exchange in multiple different temperature regions. The shell 4 and the liquid metal 2 are the same as those of the first embodiment.

Embodiment 3

[0028] The shell 4 of the present invention is a combination of two or more materials such as inorganic or organic polymers described in Example 1, so as to improve the airtightness or heat-humidity stability of the shell. The phase change material 3 and the liquid metal 2 are the same as those in the first embodiment.

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Abstract

The invention discloses a liquid metal fluid containing phase-change microcapsules, which adopts phase-change microcapsules (1) as a solute and liquid metal (2) as a solvent, wherein the phase-change microcapsules (1), which are prepared by using an in-situ polymerization method or other methods to embed a phase-change material (3) into an outer casing (4), are spherical and has the diameter of 1nm-1mm; and the liquid metal (2) can be mercury, gallium, gallium-indium alloy or gallium-indium-tin alloy. The invention has the advantages that the liquid metal fluid containing the phase-change microcapsules has a large apparent ratio in the phase-change temperature area of a phase-change material, the phase-change microcapsules (1) are difficult to be deposited or aggregated, the liquid metal fluid has favorable performances in the aspects of calorifics, electrics, magnetics, and the like, and the thermal properties of traditional liquid metals can be enhanced greatly. The liquid metal fluid is a cooling medium suitable for various heat radiating occasions with high heat flux density, and can be widely applied to the fields of computer chips, satellites, rocket propulsion booster and lasers.

Description

technical field [0001] The invention relates to a cooling fluid working medium for a radiator with high power density, in particular to a cooling fluid working medium composed of phase change microcapsules and liquid metal. Background technique [0002] With the rapid development of high performance, miniaturization and integration of the chip industry, the problem of chip heat dissipation has become a bottleneck affecting the development of the chip industry today. At present, traditional cooling methods such as air cooling (Zhang Qianshan, patent: computer CPU radiator, application number: 01130819.2), water cooling (Zhu Yuru, patent: CPU chip water cooling radiator, patent number: 99253842.4) and semiconductor refrigeration sheet method etc. It has been unable to meet the thermal control requirements of high heat flux chips. Using phase conversion heat (Li Mujiong et al., patent: system for cooling computer devices, application number: 99804075.4), heat pipe heat dissipa...

Claims

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Application Information

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IPC IPC(8): C09K5/06B01J13/18
Inventor 吕永钢杨力
Owner CHONGQING UNIV
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