Manufacturing tooling for cascaded film-substrate bonding body and optical device manufacturing method
A technology for film optics and production methods, which is applied in chemical instruments and methods, optical components, lamination devices, etc., can solve the problems of poor uniformity of the adhesive layer and low angular precision of the cascaded films, and achieve high uniformity of the adhesive layer and improved Light energy utilization, small wavefront distortion
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[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0036] figure 1 Schematic diagram of the structure of the tooling for the cascaded film-substrate bonded body of the embodiment of the present invention, as shown in figure 1 As shown, the cascaded thin film substrate bonded body manufacturing tooling according to the embodiment of the present invention is used to make a cascaded thin film substrate bonded body, and the cascaded thin film substrate bonded body is used to make cascaded thin film optical devices, including: Too...
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