A device and method for quickly measuring the heat capacity of thin film materials

Abstract

The invention discloses a device and method for fast measuring of heat capacity of a thin film material. In particular, the device includes a control device, a clock synchronizer, a flat peak laser device, a fast thermometer and a heat capacity output device; the control device is in signal connection with the clock synchronizer, and the clock synchronizer is in signal connection with the flat peak laser device and the fast thermometer; in a working state, the control device sends a starting signal to the clock synchronizer, the flat peak laser device and the fast thermometer are in coordinated interaction, and the flat peak laser device irradiates lasers having the energy space distribution of flat peaks to the sample surface; at the same time, the fast thermometer captures the surface temperature of a sample at a certain time point at the heating process of the sample, the test data are inputted into a heat capacity output device, and required heat capacity parameters are obtained. The device has simple structure, the method is high in efficiency and accurate, and reliable parameter data can be provided for setting of various thermophysical properties of ultra-thin semiconductorthin films.

Description

technical field [0001] The invention relates to the field of thermal measurement, and more particularly to a device and method for rapidly measuring the thermal capacity of thin film materials. Background technique [0002] The thin film material is deposited on the substrate by physical or chemical means. Since the dimension of the substrate in the thickness direction is usually hundreds or even thousands of times larger than the thickness of the film, the measurement of the thermal properties of the thin film material becomes a difficult problem. [0003] Traditional heat capacity measurement techniques such as Differential Scanning Calorimetry (DSC) and hot plate method can usually only measure a single bulk sample, but cannot measure a thin film sample with a substrate. [0004] The thermal grid method and the delay method are newly developed new methods to measure the heat capacity of thin-film materials by using laser technology. The principle of the thermal grating m...

AI Technical Summary

Problems solved by technology

[0005] Although the deposition technology of industrial thin films has been widely used, there are still a lot of difficulties in measuring the thermal properties of thin films deposited on the substrate surface, and there is still a lack of a new device and method for measuring the heat capacity of thin film materials in this field.

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