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LED chip cutting channel mark and manufacturing method thereof

A technology of LED chips and manufacturing methods, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of difficult control of the cutting line, and achieve the effects of low cost, strong practicability, and simple operation

Active Publication Date: 2018-04-20
马鞍山太时芯光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems in the prior art that there is separation of crystal grains and the deviation of dicing lines is difficult to control, the present invention provides a dicing line mark for LED chips and a method for making the scribing line mark

Method used

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  • LED chip cutting channel mark and manufacturing method thereof
  • LED chip cutting channel mark and manufacturing method thereof
  • LED chip cutting channel mark and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] like figure 1 , figure 2 and image 3 As shown, the crystal grains on the LED chip are generally arranged neatly to form a longitudinal cutting line 101 and a transverse cutting line 102. The traditional cutting method is to alternately perform several horizontal cuttings and several longitudinal cuttings along the cutting line. The method is improved, and a cutting road mark 3 is made on the cutting road. The cutting road mark 3 is located on the lateral and longitudinal cutting roads of the LED chip, and is formed by wet etching, and the depth is about. In this embodiment, the dicing lane markings are preferably square, with a side length of 28 μm, and are arranged equidistantly on the LED chip dicing lanes, and the markings on the same dicing lane are located on a straight line. identification, can be used as a reference mark during the cutting process.

[0036] The manufacturing method of the above-mentioned LED chip dicing road marking includes the following ...

Embodiment 2

[0045] like figure 1 , figure 2 and image 3 As shown in the figure, an LED chip cutting road mark is located on the LED chip cutting road, formed by wet etching, and the depth is about. In this embodiment, the dicing lane marks are preferably circular, with a diameter of 25 μm, and are arranged equidistantly on the LED chip dicing lanes, and the markings on the same dicing lane are located on a straight line.

[0046] The manufacturing method of the above-mentioned LED chip dicing road marking includes the following steps:

[0047] a. Vacuum coating: Evaporate a silicon dioxide layer on the P side of the LED chip, and the thickness of the silicon dioxide layer is

[0048] b. Photolithography: photolithography is performed on the silicon dioxide layer coated in step a, and photoresist is used to protect the marking of the cutting track and the electrode area;

[0049] c. Wet etching of silicon dioxide layer: wet etching is performed on the silicon dioxide layer on the...

Embodiment 3

[0055] like figure 1 , figure 2 and image 3 As shown in the figure, an LED chip cutting road mark is located on the LED chip cutting road, formed by wet etching, and the depth is about. In this embodiment, the dicing lane marks can be rhombus or polygonal. On the premise that the manufacturing method is simple, you can choose which shape to make according to your needs, preferably a square, with a side length of 30 μm, which are arranged equidistantly on the LED chip dicing lane, and the same cut Road markings are in a straight line.

[0056] The manufacturing method of the above-mentioned LED chip dicing road marking includes the following steps:

[0057] a. Vacuum coating: Evaporate a silicon dioxide layer on the P side of the LED chip, and the thickness of the silicon dioxide layer is

[0058] b, photolithography: carry out photoetching treatment on the silicon dioxide layer after the coating in step a, and cut the track mark and the electrode area ( figure 1 2 i...

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Abstract

The invention discloses an LED chip cutting channel mark and a manufacturing method thereof, and belongs to the processing field of a semiconductor device. Whether a tool mark is in offset or not in acutting process can be judged by a method of manufacturing a cutting channel mark in a GaP layer of an LED chip; the method is very skilful, capable of accurately positioning the cutting position andfeeding back the cutting quality, and low in cost; the mark manufacturing method adopts wet etching; the mark part is protected by photoresist in the chip etching process; and the desired mark can beobtained after etching, and the mark can be circular, square and the like.

Description

technical field [0001] The invention belongs to the field of semiconductor device processing, and more particularly, relates to an LED chip cutting track mark and a manufacturing method thereof. Background technique [0002] During the manufacturing process of a semiconductor chip, the grains are generally arranged in a rectangular shape on the surface of the chip. Existing chip cutting methods mainly include cutter (such as diamond cutter) cutting and radiant energy (such as laser) cutting. Tool cutting is to use mechanical force to directly act on the cutting path of the chip to achieve the separation of the grains. Laser cutting is a non-contact cutting method. It obtains high energy density after laser energy is optically focused, and directly vaporizes the chip along the cutting path to separate the crystal grains. Due to the high cost of the laser method, knife cutting is still the most commonly used chip cutting method. The traditional chip cutting method is to use...

Claims

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Application Information

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IPC IPC(8): H01L23/544H01L33/48
CPCH01L23/544H01L33/48H01L2933/0033
Inventor 廉鹏石剑波徐鹏王祥陈立陈筱娟
Owner 马鞍山太时芯光科技有限公司