A kind of LED chip dicing line marking and manufacturing method thereof
An LED chip and manufacturing method technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of difficult control of cutting lines, and achieve the effects of low cost, strong practicability and simple operation.
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Embodiment 1
[0035] Such as figure 1 , figure 2 and image 3 As shown, the crystal grains on the LED chip are generally neatly arranged to form a vertical cutting line 101 and a horizontal cutting line 102. The traditional cutting method is to alternately perform several times of horizontal cutting and several times of vertical cutting along the cutting line. The method is improved, and the scribe mark 3 is made on the scribe line. The scribe line mark 3 is located on the horizontal and vertical scribe lines of the LED chip, and is formed by wet etching, with a depth of about. In this embodiment, the dicing mark is preferably a square with a side length of 28 μm, arranged equidistantly on the LED chip dicing road, and the marks on the same dicing road are located on a straight line, and the color of the dicing road mark 3 is distinct from the color of the surrounding chips, which is easy Identification, can be used as a reference mark during the cutting process.
[0036] The method f...
Embodiment 2
[0045] Such as figure 1 , figure 2 and image 3 As shown, a LED chip dicing line mark, the mark is located on the LED chip dicing line, formed by wet etching, the depth is about. In this embodiment, the markings of the dicing lanes are preferably circular, with a diameter of 25 μm, arranged equidistantly on the dicing lanes of the LED chip, and the markings on the same dicing lane are located on a straight line.
[0046] The method for making the above-mentioned LED chip dicing lane mark includes the following steps:
[0047] a. Vacuum coating: Evaporate a silicon dioxide layer on the P surface of the LED chip, and the thickness of the silicon dioxide layer is
[0048] b. Photolithography: photoetching is performed on the silicon dioxide layer coated in step a, and photoresist is used to protect the cutting line mark and the electrode area;
[0049] c. Wet etching of the silicon dioxide layer: wet etching the silicon dioxide layer on the P side of the LED chip after s...
Embodiment 3
[0055] Such as figure 1 , figure 2 and image 3 As shown, a LED chip dicing line mark, the mark is located on the LED chip dicing line, formed by wet etching, the depth is about. In this embodiment, the dicing mark can be diamond-shaped or polygonal. On the premise that the manufacturing method is simple, you can choose which shape to make according to your needs. It is preferably a square with a side length of 30 μm, arranged equidistantly on the LED chip dicing road, and the same cutting The markings on the road are in a straight line.
[0056] The method for making the above-mentioned LED chip dicing lane mark includes the following steps:
[0057] a. Vacuum coating: Evaporate a silicon dioxide layer on the P surface of the LED chip, and the thickness of the silicon dioxide layer is
[0058] b, photolithography: carry out photoetching treatment to the silicon dioxide layer after step a film coating, cut mark and electrode area ( figure 1 Shown in the 2 position) u...
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Abstract
Description
Claims
Application Information
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