Bionic air-cooled minisize radiator with bionic grass carp fish scale microstructure surface

Abstract

The invention discloses a bionic air-cooled minisize radiator with a bionic grass carp fish scale microstructure surface; the bionic air-cooled minisize radiator comprises a thermal conductor and morethan two radiating fins; the thermal conductor is a solid column; the radiating fins are respectively in a sheet type, and fixed on the side surface of the thermal conductor in a radial manner, wherein each radiating fin is parallel to the central axis of the thermal conductor; the top surface and/or bottom surface of each radiating fin are provided with a plurality of radiating ribs with the fully identical structures; each radiating rib is arranged in an oblique and up-protruding manner on the surface of the radiating fin; all radiating ribs are arranged in mutual parallel at intervals on the surface of the radiating fins, and each radiating rib extends in the direction parallel to the central axis of the thermal conductor. Compared with a smooth surface, the radiator employs the bionicgrass carp fish scale microscopic surface structure, thus increasing the heat radiation areas by 15 to 40%, increasing the heat radiation efficiency in a unit heat radiation area, and greatly enhancing the radiating fin thermal diffusivity.

Description

technical field [0001] The invention relates to the technical field of enhanced heat transfer, in particular to a bionic air-cooled miniature radiator imitating the microstructure surface of grass carp and fish scales. Background technique [0002] At present, the rapid development of the electronics industry has made the integrated components on the PCB circuit board highly dense, the circuit is complicated, and the packaging density is concentrated, which in turn increases the heat flux density of the components on the PCB circuit board and the temperature rises. In addition, the component size and shape of the components on the PCB circuit board continue to shrink, which also makes the temperature increase more serious. Especially the CPU processor on the PCB circuit board, its temperature will continue to rise with the calculation speed of the data it processes, and the heat release will increase. If the heat generated by the CPU processor during work cannot be resolved,...

AI Technical Summary

Problems solved by technology

Especially the CPU processor on the PCB circuit board, its temperature will continue to rise with the calculation speed of the data it processes, and the heat release will increase. If the heat generated by the CPU processor during work cannot be resolved, it will not only make the CPU The running speed of the processor becomes slow, and it will also accelerate aging. In severe cases, the CPU will fail, and even the chip will be burned

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