Cutting method of display panel motherboard, display panel, and display device
A technology of display panel and cutting method, which is applied in the direction of identifying devices, instruments, electrical components, etc., can solve problems such as low product yield and film rupture, and achieve the effect of improving product yield
Active Publication Date: 2020-03-17
BOE TECH GRP CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
[0005] The primary purpose of the present invention is to provide a method for cutting display panel mother boards, to solve the problem of film rupture caused by cutting external force, and to solve the problem of low product yield
[0006] Another object of the present invention is to provide a display panel to solve the problem of low product yield
[0007] Another object of the present invention is to provide a display device for solving the problem of low product yield
Method used
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Embodiment Construction
[0051] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0052] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refers to the presence of said features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, Integers, steps, operations, elements, components, and / or groups thereof. It will be unders...
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Abstract
The embodiment of the invention provides a cutting method of a display panel mother board, a display panel and a display device. The cutting method comprises the steps of: making a buffer layer and aninterlayer insulating layer in order on a substrate, wherein edge areas of a display panel are covered with the buffer layer and the interlayer insulating layer; removing part of the interlayer insulating layer arranged at the edge areas, forming a first pattern, and exposing part of the buffer layer; performing ion implantation processing of the exposed buffer layer; and performing cutting alonga cutting line. The exposed buffer layer is subjected to ion implantation processing to become a low-stress film layer, and therefore, film layer cracking caused by the cutting external force cannotbe continuously extended towards the internal portion of a display screen, and the product yield rate is improved.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a cutting method of a display panel motherboard, a display panel, and a display device. Background technique [0002] Flexible display is an important development direction of next-generation display technology. This technology has the characteristics of being bendable, not fragile, ultra-light and ultra-thin, low power consumption, and portable. Broad application prospects and good development expectations. Currently, substrate materials used in flexible displays include organic plastics, thin metal foils, and thin glass. [0003] In the current preparation method of flexible display, cutting process is required after laser peeling, and the large panel (flexible display panel mother board) is divided into small panels (flexible display panel) for the subsequent module assembly process, and the common cutting methods are as follows: Knife cutting and laser cutting. Because th...
Claims
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IPC IPC(8): H01L21/304H01L21/311H01L21/3115G09F9/30
CPCG09F9/301H01L21/3043H01L21/31111H01L21/31116H01L21/31155
Inventor 高涛
Owner BOE TECH GRP CO LTD