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Epoxy resin composition

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problem of inability to cope with heat curing, and achieve the effect of excellent bonding strength and pot life

Pending Publication Date: 2018-05-11
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Patent Documents 1 and 2 cannot cope with such low-temperature and short-time thermal curing

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0129] Example 1 is an example of using only an aromatic epoxy resin as the epoxy resin of the (A) component,

[0130] Examples 2 and 3 are examples in which an aromatic epoxy resin and an aliphatic epoxy resin are used together as the epoxy resin of the (A) component and a thickening inhibitor is added as the (D) component, and Example 4 is changed as ( An example of an aromatic epoxy resin used as the epoxy resin of component A, and Example 5 is an isocyanate adduct-type microcapsule containing DABCO as an active ingredient that was used as component (C) instead of Example 4. Example 6 and 7 are examples of changing the thiol-based curing agent of the (B) component to Example 4, and Example 8 is an example of adding a thickening inhibitor to Example 4 as (D) As examples of components, Examples 9 to 11 are examples in which the thickening inhibitor of the component (D) was changed from Example 8.

[0131] These examples are all capable of low-temperature short-time curing at...

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PUM

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Abstract

The present invention provides an epoxy resin composition which is able to be thermally cured at a low temperature around 100 DEG C or less in a short time around 10 minutes or less, while having excellent bonding strength and excellent pot life. An epoxy resin composition according to the present invention is characterized by containing (A) an epoxy resin, (B) a thiol-based curing agent and (C) an isocyanate adduct-type microencapsulated curing accelerator that contains, as an active ingredient, 1,4-diazabicyclo[2.2.2]octane (DABCO), and is also characterized in that: the ratio (mass ratio) of an aromatic epoxy resin to an aliphatic epoxy resin in the epoxy resin serving as the component (A) is from 10:0 to 2:8; and the amount of DABCO in the component (C) is 0.01-2 parts by mass relativeto 100 parts by mass of the total of the components (A)-(C).

Description

technical field [0001] The present invention relates to a one-component adhesive resin composition suitable for applications requiring low-temperature short-time curing at 100°C for less than 20 minutes or at 80°C for less than 60 minutes. Background technique [0002] Epoxy resins have excellent material properties such as electrical insulation, mechanical strength, heat resistance, moisture resistance, and adhesion. Therefore, epoxy resins are used as the main agent and include curing agents and / or curing accelerators The epoxy resin composition of the agent is widely used as an adhesive for electronic parts. Examples of the curing agent for epoxy resins used for the above purpose include amine-based curing agents, phenol-based curing agents, acid anhydride-based curing agents, and the like. On the other hand, there are imidazoles and the like as curing accelerators for epoxy resins used for the above-mentioned purpose. [0003] When manufacturing an image sensor module ...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08G59/56C09J11/06C09J163/00H01L21/52
CPCC08G59/56C08G59/66C09J11/06C09J163/00H01L21/52C08K5/09C08K5/098H01L27/146
Inventor 岩谷一希今井一成
Owner NAMICS CORPORATION
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