Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for determination of thermal stress of prepregs, metal-clad laminates, wiring boards, and wiring board materials

A prepreg, tensile stress technology, used in metal layered products, circuit substrate materials, and the use of stable tension/pressure to test the strength of materials, etc., can solve package warpage, differences, semiconductor chip and substrate connection Reduced reliability and other problems, to achieve the effect of suppressing warpage

Active Publication Date: 2021-08-24
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, due to the difference in the coefficient of thermal expansion (Coefficient of Thermal Expansion: CTE) between the semiconductor chip and the substrate, deformation such as warping of the package due to temperature changes may occur.
In addition, in such a package, if the warpage increases, the force to peel off the semiconductor chip and the substrate will increase, and the connection reliability between the semiconductor chip and the substrate will also decrease.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for determination of thermal stress of prepregs, metal-clad laminates, wiring boards, and wiring board materials
  • Method for determination of thermal stress of prepregs, metal-clad laminates, wiring boards, and wiring board materials
  • Method for determination of thermal stress of prepregs, metal-clad laminates, wiring boards, and wiring board materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0121] 41.67 parts by mass of naphthalene-type epoxy resin (HP9500 manufactured by DIC Corporation), 28.33 parts by mass of naphthalene-type phenolic curing agent (HPC9500 manufactured by DIC Corporation), epoxy-modified acrylic resin (PMS manufactured by Nagase ChemteX Corporation) -12-82 (500,000 weight molecular weight)) 30 parts by mass, 0.04 parts by mass of imidazole (2E4MZ manufactured by Shikoku Chemical Industry Co., Ltd.: 2-ethyl-4-methylimidazole) as a curing accelerator, and isocyanate silane A resin composition was obtained by mixing 50 parts by mass of spherical silica (SC2500GNO manufactured by Admatechs Company Limited) with a surface-treated coupling agent. Then, this resin composition was diluted with 151 parts by mass of methyl ethyl ketone (MEK) as a solvent, thereby preparing a varnish-like resin composition (resin varnish).

[0122] Using the obtained resin varnish, it was impregnated into a woven fabric substrate (glass cloth, Nitto Boseki Co., Ltd. 1078...

Embodiment 2

[0125] As the woven fabric substrate, use another glass cloth, that is, Nitto Boseki Co., Ltd. T2013 (thickness 71 μm, unit weight 80 g / m 2 ), except that the resin varnish was impregnated so as to have a thickness of 0.1 mm, and a prepreg was obtained in the same manner as in Example 1. Furthermore, for one obtained prepreg, copper foil (thickness 12 μm) was laminated as a metal foil on both sides thereof, and the prepreg was vacuum-conditioned at 2.94 MPa (30 kgf / cm 2 ) was pressed and molded while being heated at 220° C. for 60 minutes to manufacture a copper-clad laminate (CCL) with a thickness of 0.1 mm as a metal-clad laminate.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The prepreg is composed of a resin layer formed of a semi-cured product of a thermosetting resin composition, and a fibrous base material provided in the resin layer. Using a prepreg test piece obtained by thermally curing a thermosetting resin composition to obtain a cured product, the maximum value of thermal shrinkage stress measured by a predetermined thermal stress test is 400 kPa or less.

Description

technical field [0001] The invention relates to a method for measuring thermal stress of prepreg, metal-clad laminate, wiring board and wiring board material. Background technique [0002] As electronic devices become smaller and thinner, surface mount packages are increasingly used as electronic components included in the electronic devices. As such a package, the package which mounted the semiconductor chip on the board|substrate, such as COB (Chip On Board) specifically, is mentioned. Such a package has a structure in which a semiconductor chip and a substrate are bonded. Therefore, due to the difference in coefficient of thermal expansion (Coefficient of Thermal Expansion: CTE) between the semiconductor chip and the substrate, deformation such as warping of the package due to temperature changes may occur. In addition, in such a package, if the warpage increases, the force to peel off the semiconductor chip and the substrate will increase, and the connection reliabilit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/24B32B5/28B32B15/08H01L23/14H05K1/03
CPCB32B37/10B32B2038/0076B32B2309/02B32B2309/105C08J2363/00B32B2457/08G01N3/18G01N2203/0017G01N2203/0057H05K1/0271H05K1/0373H05K1/038H05K2201/0209H05K2201/068B32B2250/40B32B2307/308B32B2260/028B32B15/20B32B2250/03B32B2307/54B32B15/12B32B15/14B32B2260/021B32B2264/102B32B2264/104B32B2262/0276B32B2262/101B32B5/022B32B5/024B32B2260/046B32B2262/0269C08J5/244B32B5/28B32B15/08B32B37/1018H05K3/06
Inventor 柏原圭子井上博晴吉冈慎悟星孝
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD