Liquid crystal display mother board and manufacturing method thereof

Abstract

The invention provides a liquid crystal display mother board and a manufacturing method thereof. The liquid crystal display mother board comprises an array substrate and a color film substrate which are oppositely arranged, a clamping structure which is arranged between the array substrate, the color film substrate and is made of a photoresist and a residual material supporting the non-display region of the liquid crystal display mother board and connecting the array substrate and the color film substrate, wherein the array substrate is provided with a plurality of TFT substrates arranged in an arrayed mode; the clamping structure is used for replacing a virtual sealing frame adhesive and an annular sealing frame adhesive. The clamping structure made of the photoresist replaces the commonvirtual sealing frame adhesive and the annular sealing frame adhesive to achieve the same effect, and due to the fact that the clamping structure can be manufactured through a common exposure technology in the manufacturing process of the array substrate or the color film substrate, the requirement for the manufacturing process of coating the virtual sealing frame adhesive and the annular sealingframe adhesive is lowered, and the product pitch time is shortened; the clamping structure is manufactured in an exposure mode, the precision is higher, the floor area is small, and therefore the product cost is lowered.

Description

technical field [0001] The invention relates to the technical field of screen display, in particular to a liquid crystal display motherboard and a manufacturing method thereof. Background technique [0002] The liquid crystal display motherboard is formed by combining a thin film transistor (TFT) substrate and a color filter (Color Filter, CF) substrate, and injecting liquid crystal between the two substrates using the One Drop Filling (ODF) process. There are generally multiple TFT substrates 11´ distributed on the large-size glass substrate 1´, and the TFT and CF substrates are bonded by frame glue, such as figure 1 As shown, in addition to the main seal (Main seal) 13´ in the TFT substrate 11´, there is also a Dummey seal (Dummey seal) 15´ between the TFT substrates 11´, and a ring along the edge of the glass substrate 1´. Loop seal 14´. Such as figure 2 , image 3 As shown, the role of virtual sealing frame glue 15´ and ring sealing frame glue 14´ is mainly to suppo...

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Problems solved by technology

[0003] However, the virtual sealant 15´ and the ring sealant 14´ on the glass substrate 1´ are numerous and complex, so the ODF process takes a lot of time to coat these two types of sealant, and due to the Because the width accuracy is not easy to control and other reasons, a large space must be reserved on the substrate for the footprints of these two frame glues, which limits the utilization rate of the substrate and hinders the diversified design of products

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