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A production method and circuit board technology, which is applied in the fields of printed circuit manufacturing, printed circuit, conductive pattern reinforcement, etc., can solve the problems of electroplating interlayer film, electroplating tin interlayer film, etc., so as to improve quality, improve production efficiency, and solve tin clipping The effect of the membrane problem
Inactive Publication Date: 2018-05-18
JIANGMEN SUNTAK CIRCUIT TECH +1
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Abstract
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Problems solved by technology
[0004] The present invention aims at the problem of electroplating film often appearing in pattern electroplating in the production process of existing printed circuit boards, and provides a method for making circuit boards. This method changes the traditional tin plating to nickel-immersion, and solves the problems of pattern electroplating circuits. The problem of tin-plated film often occurs, which reduces the scrap rate of circuit boards, reduces the production cost of circuit boards, and improves the quality of circuit boards
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Embodiment 1
[0019] This embodiment provides a method for manufacturing a circuit board, including the following steps:
[0020] (1) According to the existing technology, the core board is sequentially subjected to the process of material cutting→making inner layer circuit→pressing→drilling→immersing copper→full board electroplating process, the details are as follows:
[0021] a. Cutting: Cut out the core board according to the panel size of 520mm×620mm. The thickness of the core board is 1.2mm, and the thickness of the outer copper foil of the core board is 0.5μm.
[0022] b. Inner layer circuit production (negative film process): Inner layer graphics transfer, use a vertical coating machine to coat photosensitive film, the thickness of the photosensitive film is controlled to 8 μm, use a fully automatic exposure machine, and use a 5-6 grid exposure ruler (21 grids) Exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch the exposed and developed co...
Embodiment 2
[0047] This embodiment provides a method for manufacturing a circuit board with blind and buried vias, comprising the following steps:
[0048] (1) Cutting: Cut out two or more core boards according to the board size 520mm×620mm, including an inner core board with blind buried holes.
[0049] (2) Drilling: use drilling data to drill holes on the inner core board with blind buried holes;
[0050] (3) Making the inner layer circuit (positive film process): making the inner layer circuit on the inner layer core board after drilling, specifically including the following steps:
[0051] a. Inner layer graphics transfer: Paste the anti-chemical gold dry film on the inner core board, use a fully automatic exposure machine and positive line film, and use 5-7 grid exposure rulers (21 grid exposure rulers) to complete the inner layer circuit exposure. Developing, forming the inner circuit pattern on the inner core board.
[0052] b. Degreasing: remove the oxide layer and oil stains on...
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Abstract
The invention discloses a manufacturing method of a circuit board. According to the method, a positive process is adopted to manufacture an inner-layer circuit and / or an outer-layer circuit. The positive process includes the following steps that: a circuit pattern is formed on a circuit board through a film coating procedure, an exposure procedure and a developing procedure sequentially; copper isplated at the circuit pattern on the circuit board, so that an electroplated copper layer can be formed; electroless nickel treatment is performed, so that a nickel layer can be formed on the surfaceof the electroplated copper layer; and film removal and etching treatment are performed sequentially, the circuit is formed on the circuit board through etching. According to the manufacturing methodof the invention, conventional tin plating performed after copper plating is replaced by the electroless nickel treatment, so that the nickel layer with uniform thickness can be deposited through theelectroless nickel treatment after the copper is plated onto the outer-layer circuit pattern, and therefore, the deviation of protective layer thickness (tin thickness) caused by special pattern distribution can be completely avoided, and the problem of the film clamping of electrolytic tinning during circuit electroplating which is performed on the pattern can be solved, the scrap rate of the circuit board can be decreased, the cost production of the circuit board can be decreased, and the quality of the circuit board can be improved.
Description
technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for manufacturing a circuit board. Background technique [0002] With the rapid development of the PCB industry, PCB is gradually moving towards the direction of high-precision fine lines, small aperture, and high aspect ratio (6:1-10:1). The development trend of globalization and narrowing of line spacing has increased the difficulty of circuit board production. When making outer-layer lines, the problem of electroplating sandwich film often occurs in the graphic plating process. For example, PCBs with hole copper requirements of 20-25 μm and line spacing ≤ 4mil, Generally, there is a problem of electroplating interlayer in the production process; electroplating interlayer will cause short circuit of the circuit, which will affect the first-time yield of the outer circuit on the PCB during AOI inspection, and in the case of severe interlayer or ...
Claims
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Application Information
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