Paddy rice leaf imitation microstructural surface enhanced heat transfer micro-electronic heat exchanger

Abstract

The invention discloses a paddy rice leaf imitation microstructural surface enhanced heat transfer micro-electronic heat exchanger which comprises a heat exchange base, a heat exchange body and a heat-conducting conduit; the heat exchange body consists of a plurality of heat exchange sheets arranged side by side; each heat exchange sheet is sheeted; a plurality of upward raised heat exchange ribsare arranged on the surface of each heat exchange sheet; each heat exchange rib is strip-shaped; the cross sections of the heat exchange ribs are rectangular; the all of the heat exchange ribs are arranged on the surfaces of the heat exchange sheets in parallel in a spaced manner; the heat-conducting conduit is inverted-U-shaped; one end of the heat-conducting conduit transversely penetrates through the heat exchange base; the other end of the heat-conducting conduit transversely penetrates through the heat exchange body and gathers the all of the heat exchange sheets forming the heat exchangebody together; and the all of the heat exchange sheets are arranged in parallel in a spaced manner. Paddy rice leaf imitation surface microstructures are additionally arranged on the surfaces of theheat exchange sheets, so that the generating and disengagement frequency of air bubbles on the surfaces can be increased.

Description

Technical field [0001] The invention relates to the technical field of enhanced heat transfer, in particular to an enhanced heat transfer microelectronic heat exchanger imitating the surface of the rice leaf microstructure. Background technique [0002] At present, most of the heat exchangers on the market are heat exchange fins with smooth surfaces made of aluminum or copper. The advantage of this type of heat exchanger is to use the good thermal conductivity of aluminum or copper materials to attach the heat exchanger to the On the main board, the heat of the main board is transferred to the heat exchange fins. Driven by the flow of gas formed by the fan on the heat exchanger, the heat on the heat exchange fins is discharged to the outside to play a cooling role. However, with the continuous innovation of modern computers and the continuous increase of the operating memory of computer software, the corresponding operating power of the microelectronic CPU has also increased, and...

AI Technical Summary

Problems solved by technology

However, with the continuous innovation of modern computers and the continuous increase of the operating memory of computer software, the corresponding operating power of the microelectronics CPU has also increased, and the heat generated has also increased. The heat transfer rate and heat transfer performance of traditional heat exchangers have been reduced. It is far from meeting the cooling requirements of the CPU. In this case, higher requirements are placed on the microelectronic heat exchanger.

As the power of microelectronics increases, heat production increases accordingly. If traditional heat exchangers continue to be used, traditional heat exchangers cannot exchange heat in time, resulting in continuous heat accumulation on the CPU motherboard, and many problems will arise, such as the temperature of the CPU. Too high can cause computer crashes, restarts, blue screens, and even burn out the motherboard

Images