Intelligent gas hood based on high/low-temperature impact system

Abstract

The invention provides an intelligent gas hood based on a high/low-temperature impact system. The intelligent gas hood comprises a high/low-temperature-resistant sealing ring, gas flow sensors, horizontal drive mechanisms, a stirring fan, a motor and a fixation support base. The high/low-temperature-resistant sealing ring is arranged at the bottom portion of the fixation support base; the gas flowsensors and the horizontal drive mechanisms are arranged on the high/low-temperature-resistant sealing ring; and the stirring fan is arranged in the intelligent gas hood through the motor. The intelligent gas hood based on the high/low-temperature impact system can prevent high/low-temperature gas flow from directly impacting a test sample, thereby improving test data accuracy, reducing high/low-temperature gas flow leakage, reducing test noise, reducing secondary damage caused by high/low-temperature gas flow leakage and improving test safety.

Description

Technical field [0001] The invention relates to an automatic control device for a high and low temperature impact system test gas hood, and particularly relates to an intelligent gas hood based on a high and low temperature impact system. Background technique [0002] At present, the high and low temperature impact system used in the semiconductor industry directly impacts the test sample with high and low temperature airflow. This causes uneven temperature distribution in each part of the test sample, resulting in uneven force on each part, affecting the yield of the test sample and the accuracy of the test data. Some test engineers add porous nozzles to single-hole nozzles to reduce the direct impact of airflow on the test samples. But there is not much improvement. There is a temperature difference in each part of the test sample, which cannot simulate the working environment of the test sample. [0003] At present, the tightness of the contact between the gas hood and the test...

AI Technical Summary

Problems solved by technology

But there is not much improvement. There is a temperature difference in each part of the test sample, which cannot simulate the working environment of the test sample.

[0003] At present, the airtightness of the contact between the gas mask and the test board of the high and low temperature test system needs to be adjusted repeatedly by the test engineer, which is time-consuming and laborious.

When encountering large-scale sample testing, the contact seal type cannot be guaranteed. Due to the imperfection of the seal, the leakage of high and low temperature airflow will cause noise, and the high temperature airflow (125 degrees) will burn the test staff.

The liquefaction of the low-temperature airflow (minus 40 degrees) produces water droplets that flow into the machine below, causing short circuit and leakage of electricity, and endangering the safety of test staff and the machine.

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