A vacuum casting device and casting method for room temperature curing epoxy resin

Abstract

The invention discloses a room-temperature curing epoxy resin vacuum pouring device which comprises an environment temperature adjusting component, a sealant assembly, and a vacuum pressure adjustingcomponent; the environment temperature adjusting component is composed of a semi-closed operation box and an air conditioner; the sealant component consists of a resin defoaming tank, a pouring workpiece, and a resin collection tank disposed in the semi-closed operation box, a shell of the pouring workpiece is provided with a resin in-and-out port, and a mold groove is arranged outside the pouringworkpiece; the vacuum pressure adjusting component comprises a pump preceding stage buffer tank, a vacuum gauge, and a vacuum pump, wherein the pump preceding stage buffer tank is separately connected with an air extraction port and the resin collection tank; and the invention also discloses a debubbling method, the pouring device and the debubbling method can meet the demand for high-amount room-temperature curing epoxy resin vacuum pouring, the pouring rate is high, the resin temperature can be effectively controlled, the curing time can be prolonged, the debubbling efficiency can be increased within a limited time, and full mold filling of resin can be guaranteed.

Description

technical field [0001] The invention belongs to epoxy resin vacuum pouring technology, in particular to a room temperature curing epoxy resin vacuum pouring device with short curing time and large amount of resin, and a pouring method. Background technique [0002] In the field of superconducting applications, low-temperature epoxy resin is used as a filling material for superconducting coils to improve the mechanical strength and insulation properties of superconducting coils. In order to reduce the thermal stress generated by the coil during the cooling process and avoid damage to the magnet during the cooling process, room temperature curing epoxy resin is usually selected. After adding the curing agent, this kind of resin begins to undergo exothermic reaction. Usually the curing time is very short, some only a few hours. If the temperature of the resin is not controlled, the curing time will be further shortened. It is difficult to achieve such a short time. After finis...

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Problems solved by technology

[0004] This pouring method is difficult to adopt in room temperature curing epoxy resin. First, the gravity injection speed is slow, and the gap between superconducting coils is small and the internal environment is complicated, which further affects the pouring rate. Second, the sealed container is bulky and inconvenient to operate. , and finally, the workpiece is placed in a sealed container, and the cooling design of the workpiece becomes relatively complicated

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