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Preparation method of heat conductive polymer material

A technology of polymer materials and thermally conductive fillers, applied in the field of polymer materials, can solve problems such as difficult processing, uneven mixing of polymer materials, poor thermal conductivity, etc., and achieve the effect of improving dispersion

Inactive Publication Date: 2018-05-29
SHANGHAI SEEYAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a heat-conducting polymer material, which is directly granulated on the basis of a solution method, replacing the traditional production process of extrusion granulation, and used to solve the problems of the prior art. Poor thermal conductivity of medium and polymer materials, difficult processing and defects caused by uneven mixing of polymer materials

Method used

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  • Preparation method of heat conductive polymer material
  • Preparation method of heat conductive polymer material
  • Preparation method of heat conductive polymer material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] 1. Polycarbonate particles (accounting for 99% by weight in the composite material) were added to the dioxolane under stirring until completely dissolved, resulting in a concentration of 15% by weight.

[0058] 2. Graphene (accounting for 1 wt% in the composite material) is dispersed in dioxolane by ultrasonic at a concentration of 10 mg / mL. After uniform dispersion, add to the dioxolane solution of PC prepared in "1".

[0059] 3. Ultrasonic or stir the mixed solution obtained above for 2 hours or until the dispersion is uniform.

[0060] 4. Immediately add water to the above-mixed composite material solution, and shake to make PC and graphene evenly precipitated. The precipitated samples were dried in an oven at 60°C, and then the dried samples were pressed to prepare polymer composite boards.

Embodiment 2

[0062] The preparation method is the same as in Example 1, wherein PC accounts for 98wt% in the composite material, and graphene accounts for 2wt%.

Embodiment 3

[0064] The preparation method is the same as in Example 1, wherein PC accounts for 96wt% in the composite material, and graphene accounts for 4wt%.

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Abstract

The invention provides a preparation method of a heat conductive polymer material. The preparation method at least comprises the following steps: 1) dissolving a polymer material in a solvent, addingheat conductive filler, and mixing the materials to form a polymer material mixed solution; 2) mixing the polymer material mixed solution with a flocculation solvent to obtain a composite masterbatch.Dispersity of the heat conductive filler in a polymer material matrix can be improved effectively with a solution mixing method, so that the heat conductive filler forms a heat conductive passage inthe matrix and can reach the other surface from one surface, and heat accumulation caused by non-uniform filler distribution is avoided.

Description

technical field [0001] The invention relates to a polymer material, in particular to a preparation method of a heat-conducting polymer material. Background technique [0002] Compared with metals and inorganic non-metallic materials, polymer materials have the characteristics of low processing cost, light weight, easy molding, recyclability, excellent mechanical properties, and wide adaptability. Polymer materials have become an important material that is indispensable for national economic construction and people's daily life. However, polymer materials are generally considered as thermal insulators due to the limited free electron movement, and the thermal conductivity is usually below 0.3W / mK, which greatly limits the application of polymer materials in the field of heat dissipation and thermal conductivity materials. Therefore, under the premise of ensuring the original properties of polymer materials, endowing polymer materials with thermal conductivity can greatly exp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/215C08L69/00C08K3/04
CPCC08J3/215C08J2369/00C08K3/04
Inventor 杨晓锋孔令学游艳伊智峰顾海军
Owner SHANGHAI SEEYAO ELECTRONICS CO LTD