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Method of manufacturing micro thermoelectric device through cutting and bonding

A thermoelectric device and micro technology, which is applied in the manufacture/processing of thermoelectric devices, can solve problems such as difficulties in mechanical processing and array arrangement, and achieve the effects of solving difficulties in mechanical processing and array arrangement, low cost and simple preparation process

Active Publication Date: 2018-06-01
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above, the present invention provides a method for preparing micro thermoelectric devices by cutting and bonding, which effectively solves the difficult problems of machining and array arrangement

Method used

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  • Method of manufacturing micro thermoelectric device through cutting and bonding

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preparation example Construction

[0021] figure 1 Shown is the process flow chart of the method for preparing micro-thermoelectric devices provided by the embodiment, see figure 1 , the method includes the following steps:

[0022] (1) After cutting the P-type and N-type bulk thermoelectric materials into thin sheets with a diamond wire cutting machine, the P-type and N-type thin sheets are alternately bonded in the order of P-N-P-N with an adhesive, and the thin-sheet composite column is obtained after curing Body, such as figure 1 as shown in (a);

[0023] (2) Cut the thin-sheet composite cylinder along a direction perpendicular to the bottom surface of the thin-sheet composite cylinder to obtain a composite sheet, such as figure 1 As shown in (b), epoxy resin is used to bond the composite sheets according to the alternating pattern of P-type thermoelectric materials and N-type thermoelectric materials, and after curing, a thermoelectric arm array column is obtained, as shown in figure 1 As shown in (c),...

Embodiment 1

[0027] In this embodiment, the epoxy value of the epoxy resin is 0.5-0.55 / 100g, and the addition amount of glass microspheres is 5%, and the particle size range is 60-90 μm. The measured thermal conductivity was 0.05662 W / mK.

[0028] The process of preparing micro thermoelectric devices is as follows:

[0029] (1) Use a diamond wire cutting machine to cut out 3 thin slices each with a thickness of 700 μm from the P-type and N-type bulk thermoelectric materials, and alternately bond them with epoxy resin, and obtain thin slice composite columns after curing;

[0030] (2) Cut the composite columnar vertical bottom surface of the flakes obtained in step (1) again to obtain 6 composite flakes with a thickness of 700 μm, reverse 3 of them, and alternately bond them with the other 3 flakes, and obtain a thermoelectric arm array column after curing body.

[0031] (3) Carry out the third cut vertically to the bottom surface of the cylinder to obtain the thermoelectric arm array;

...

Embodiment 2

[0034] In this embodiment, the epoxy value of the epoxy resin is 0.5-0.55 / 100g, and the addition amount of glass microspheres is 13%, and the particle size range is 25-30 μm. The measured thermal conductivity was 0.05012 W / mK.

[0035] The process of preparing micro thermoelectric devices is as follows:

[0036] (1) Use a diamond wire cutting machine to cut out 3 thin slices each with a thickness of 700 μm from the P-type and N-type bulk thermoelectric materials, and alternately bond them with epoxy resin, and obtain thin slice composite columns after curing;

[0037] (2) Cut the composite columnar vertical bottom surface of the flakes obtained in step (1) again to obtain 6 composite flakes with a thickness of 700 μm, reverse 3 of them, and alternately bond them with the other 3 flakes, and obtain a thermoelectric arm array column after curing body.

[0038] (3) Carry out the third cut vertically to the bottom surface of the cylinder to obtain the thermoelectric arm array; ...

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Abstract

The invention discloses a method of manufacturing a micro thermoelectric device through cutting and bonding. The method comprises steps: (1) after P-type and N-type block thermoelectric materials arecut into thin sheets respectively, a bonder is used to carry out alternative bonding on P-type and N-type round sheets, and after curing, a sheet composite column body is obtained; (2) the sheet composite column body is cut along the direction perpendicular to the bottom surface of the sheet composite column body, composite sheets are obtained, epoxy resin is used to carry out bonding on the composite sheets according to a P-type and N-type thermoelectric material alternating mode, and after curing, a thermoelectric arm array column is obtained; (3) the thermoelectric arm array column is cut along a direction perpendicular to the bottom surface of the thermoelectric arm column, and a micro thermoelectric arm array is obtained; and (4) an electrode on a micro thermoelectric arm is manufactured and a micro thermoelectric device is packaged. The manufacturing process in the method is simple, the cost is low, the operation is easy, and the problems of difficulties in machining and array arrangement can be solved.

Description

technical field [0001] The invention belongs to the field of integration of thermoelectric devices, and in particular relates to a method for preparing micro thermoelectric devices by cutting and bonding. Background technique [0002] Thermoelectric materials are materials that use the movement of carriers inside a solid to achieve mutual conversion of electrical energy and thermal energy. Devices integrated with thermoelectric materials are thermoelectric devices, which can be used for power generation or cooling. Due to the simple working principle, compared with other power generation / cooling technologies, thermoelectric devices have the advantages of no moving parts, no maintenance, high reliability, environmental friendliness, and easy miniaturization. In recent years, the rapid development of micro-electromechanical systems makes micro-thermoelectric devices have broad application prospects. [0003] The commonly used thermoelectric device preparation process is as f...

Claims

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Application Information

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IPC IPC(8): H01L35/34
CPCH10N10/01
Inventor 赵新兵杨含欣曹高劭朱铁军
Owner ZHEJIANG UNIV
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