Color film forming method based on continuous magnetron sputtering

A molding method and magnetron sputtering technology, applied in sputtering coating, ion implantation coating, coating and other directions, can solve the requirements of sputtering deposition film rate are relatively high, difficult to plate oxide targets, The problem of high cost investment can achieve the effect of low equipment configuration requirements, saving coating costs and reducing equipment investment.

Inactive Publication Date: 2018-06-05
池州市正彩电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is also possible to directly sputter oxide targets (such as silicon dioxide targets, titanium dioxide targets) to generate color films of different colors. However, for reactive films, only when the film layer reaches a certain thickness can sufficient color be obtained. Depth and brightness, while magnetron sputtering multi-layer reaction film requires relatively high vacuum degree of equipment and sputtering deposition film rate, it is difficult for low-configuration coating equipment to coat oxide targets or relatively thick gases Reactive film layer, therefore, the cost of sputtering multi-layer gas reactive film is relatively high, and it is difficult for small-scale companies to put it into mass production

Method used

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  • Color film forming method based on continuous magnetron sputtering
  • Color film forming method based on continuous magnetron sputtering

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Take a piece of alumina ceramic substrate with a size of 10cm×5cm, and use Youwei IN-LINE continuous sputtering machine as the sputtering equipment. The initial coating vacuum of the process chamber is 5.0E-3pa, and the frequency of the continuous line stroke motor is 20Hz. ;

[0024] No. 1 process chamber process gas argon (120ml / min), sputtering power supply (voltage 385V, current 3.5A) sputtering chromium target;

[0025] Process gas argon (150ml / min) in the second process chamber, reactive gas oxygen (55ml / min), sputtering power supply (voltage 385V, current 4.0A) sputter metal niobium, react with oxygen to form niobium oxide film.

Embodiment 2

[0027] Take a piece of alumina ceramic substrate with a size of 10cm×5cm, and use Youwei IN-LINE continuous sputtering machine as the sputtering equipment. The initial coating vacuum of the process chamber is 5.0E-3pa, and the frequency of the continuous line stroke motor is 20Hz. ;

[0028] No. 1 process chamber process gas argon (120ml / min), sputtering power supply (voltage 395V / current 4A) sputtering chromium target;

[0029] Process gas argon (150ml / min) in the second process chamber, reactive gas oxygen (75ml / min), sputtering power supply (voltage 420v, current 6A) sputter metal niobium, react with oxygen to form niobium oxide film.

Embodiment 3

[0031] Take a piece of alumina ceramic substrate with a size of 10cm×5cm, and use Youwei IN-LINE continuous sputtering machine as the sputtering equipment. The initial coating vacuum of the process chamber is 5.0E-3pa, and the frequency of the continuous line stroke motor is 20Hz. ;

[0032] No. 1 process chamber process gas argon (150ml / min), reactive gas oxygen (65ml / min), sputtering power supply (voltage 400V, current 5A) sputter metal niobium, react with oxygen to form niobium oxide film;

[0033] The process gas of the second process chamber is argon (120ml / min), and the sputtering power supply (voltage 385V, current 3.5A) sputters a chromium target.

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Abstract

The invention relates to the magnetron sputtering film forming technique and particularly relates to a color film forming method based on continuous magnetron sputtering. The method comprises the steps of carrying out sputtering coating on the surface of a to-be-coated base material so as to form one or more metal film layers, and coating the surface of the outermost metal film layer with one or more reaction film layers, or firstly carrying out sputtering coating on the surface of the to-be-coated base material so as to form one or more reaction film layers, and coating the surface of the outermost reaction film layer with one or more metal film layers, wherein the reaction film layers are prepared by reaction of metal target materials sputtered in vacuum cavities with reactant gas and depositing, the thickness of the metal film layers is 5nm-35nm, the average visible light reflectivity is 20%-75%, and the introduction amount of reactant gas is 30ml/min-80ml/min. By virtue of mutual cooperation between the metal film layers and the reaction film layers, the preparation of multiple color films is realized, the film coating process is stable and simple, and the coating film with relatively high brightness can be prepared without excessively increasing the thickness of the reaction film layers.

Description

technical field [0001] The invention relates to a magnetron sputtering film forming technology, in particular to a color film forming method based on continuous magnetron sputtering. Background technique [0002] Sputtering deposition is the use of energetic ions in the plasma to bombard the surface of the target in a vacuum environment, so that the atoms or ions on the target are bombarded, and the bombarded particles are deposited on the surface of the substrate to grow into a thin film. Magnetron sputtering has achieved rapid development and wide application since its inception because of its fast deposition rate, high purity, good compactness and good film uniformity of the film obtained by sputtering, which has strongly impacted other industries. the status of the coating method; [0003] Generally speaking, what color the metal target is, it will be the color after the film is formed. Common such as sputtering aluminum to get aluminum bright white, sputtering brass t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/02C23C14/08C23C14/14
CPCC23C14/0036C23C14/024C23C14/083C23C14/086C23C14/14C23C14/34
Inventor 吴卫锋刘勇熊正茂唐响
Owner 池州市正彩电子科技有限公司
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