Substrate Processing System

Abstract

The present invention relates to a substrate processing system, and more specifically, relates to a substrate processing system using plasma to process a substrate. The invention discloses a substrate processing method, which is characterized in that it comprises: a plurality of substrate processing modules (100) forming an airtight processing space (S), and performing substrate processing in a state where a plurality of substrates are loaded on a tray (20) The transport module (200) is provided with a transport robot (210), combined with the plurality of substrate processing modules (100), respectively transporting or importing the tray (20) into the substrate processing module (100); the substrate The exchange module (300), combined with the transport module (200), unloads the substrates (10) that have been processed in the substrate processing module (100) from the tray (20), and loads the substrates to be processed on the Trays (20). The substrate exchange module (300) includes: a tray carrying out unit (310), which is delivered by a delivery robot (210) in order to carry out the tray (20) to the outside.

Description

technical field [0001] The present invention relates to a substrate processing system, and more specifically, to a substrate processing system for performing deposition, etching, and other substrate processing. Background technique [0002] The structure of the so-called substrate processing module includes a vacuum chamber forming a closed processing space, and a substrate supporting part, which is provided with a substrate disposed in the vacuum chamber, and is a device for etching or depositing the surface of the substrate. [0003] The substrates processed by the substrate processing module include: wafers for semiconductors, glass substrates for LCD panels, substrates for OLEDs, substrates for solar cells, etc. [0004] As an example of the above-mentioned substrate processing module, there is a substrate processing module in which a solar cell is placed on a substrate supporting part, and a cover member formed of a plurality of openings is covered on the upper side of ...

AI Technical Summary

Problems solved by technology

[0010] In such a situation, even if a maximum of three substrate processing modules 100 are combined with the transport module 200 whose planar shape is a quadrangular shape, only two substrate processing modules 200 can be combined, so the production capacity is reduced. In the case where 200 is shipped out of the tray 20, the mass production of the substrate processing module 100 should be terminated, so there is a problem that downtime occurs and the overall productivity of the substrate processing apparatus decreases.

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