Via anti-pad layout method, device, PCB and via anti-pad manufacturing device

A technology for manufacturing devices and anti-pads, applied in the field of printed circuit boards, can solve problems such as complex design and processing, and achieve the effects of reducing design and processing difficulty, improving design and processing efficiency, and reducing processing costs.

Inactive Publication Date: 2018-06-05
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a method and device for laying out via-hole anti-pads, a PCB and a via-hole anti-pad manu

Method used

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  • Via anti-pad layout method, device, PCB and via anti-pad manufacturing device
  • Via anti-pad layout method, device, PCB and via anti-pad manufacturing device
  • Via anti-pad layout method, device, PCB and via anti-pad manufacturing device

Examples

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no. 1 example

[0048] In the first embodiment of the present invention, a method for arranging via anti-pads, such as Figure 1 ~ Figure 2 shown, including the following specific steps:

[0049] Step S101, the layout device selects the size of the differential signal via anti-pad of the PCB corresponding to the quarter-wavelength resonance frequency of the differential signal via hole of the PCB when it is equal to the set frequency as the anti-pad of the differential signal via hole of the PCB smallest size.

[0050] Wherein, the set frequency is the maximum frequency in the differential mode insertion loss frequency range specified by the high-speed signal transmission protocol.

[0051] High-speed signal transmission protocols include but are not limited to: Institute of Electrical and Electronics Engineers 10G High-speed Backplane System Transmission Protocol (IEEE802.3ap-10GBase-KR), Institute of Electrical and Electronics Engineers 25G High-speed Backplane System KR4), Optical Networki...

no. 2 example

[0084] In the second embodiment of the present invention, a method for arranging via anti-pads, such as image 3 shown, including the following specific steps:

[0085] Step S201, the layout device calculates the quarter-wavelength resonant frequency of the PCB differential signal via hole according to the dielectric constant of the PCB, the size of the PCB differential signal via hole and the preset size of the anti-pad of the PCB differential signal via hole.

[0086] Among them, the anti-pad of the differential signal via is a circle, a rectangle, or a playground shape composed of a rectangle and two semicircles;

[0087] Differential signal vias are round or rectangular.

[0088] The number of stacked layers of the PCB is greater than or equal to 4 layers.

[0089] In the case that the differential signal via hole anti-pad is circular, and the differential signal via hole is circular, according to the dielectric constant of the PCB, the size of the differential signal vi...

no. 3 example

[0137] In the third embodiment of the present invention, a device for arranging via anti-pads includes the following components:

[0138] The allocation module 200 is used to select the size of the corresponding PCB differential signal via anti-pad when the quarter-wavelength resonant frequency of the differential signal via hole of the PCB is equal to the set frequency as the differential signal via anti-pad of the PCB minimum size of .

[0139] Wherein, the set frequency is the maximum frequency in the differential mode insertion loss frequency range specified by the high-speed signal transmission protocol.

[0140] High-speed signal transmission protocols include but are not limited to: Institute of Electrical and Electronics Engineers 10G High-speed Backplane System Transmission Protocol (IEEE802.3ap-10GBase-KR), Institute of Electrical and Electronics Engineers 25G High-speed Backplane System KR4), Optical Networking Forum General Electric Transceiver Protocol 25G High S...

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Abstract

The invention provides a via anti-pad layout method, device, a PCB and a via anti-pad manufacturing device. The method comprises the step in which a layout device selects a corresponding PCB differential signal via anti-pad size when a quarter-wave resonance frequency of the PCB differential signal via is equal to a set frequency as the minimum PCB differential signal via anti-pad size. Accordingto the via anti-pad layout method, the device, the PCB and the via anti-pad manufacturing device, through the design of the differential signal via anti-pad, stub effects of the PCB differential signal via can be effectively solved, the PCB design and processing difficulty is reduced, the PCB processing cost is greatly reduced, and the PCB design and processing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method and device for laying out via-hole anti-pads, and a manufacturing device for PCBs and via-hole anti-pads. Background technique [0002] At present, the capacity and signal rate of electronic systems are getting higher and higher, and the requirements for signal integrity are also more stringent. The high-speed signal transmission of a multilayer PCB (Printed Circuit Board, printed circuit board) usually adopts a layer-changing design, and the layer-changing will use a differential signal via design. At present, in the PCB design process, the built via library is generally called, and the relevant differential signal via anti-pad in the via library is designed according to the regulation that it is 0.15mm larger than the one side of the pad. This differential signal via anti-pad design method only stipulates the minimum value of the differential signal via...

Claims

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Application Information

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IPC IPC(8): H05K3/40H05K3/00
CPCH05K3/0005H05K3/4007H05K2201/09372
Inventor 尹昌刚马峰超曹化章
Owner ZTE CORP
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