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Adhesive

An adhesive and adherend technology, applied in the directions of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of difficult wafer fixing, low softening point, and adhesive flow, etc. Effects of natural peeling, excellent coatability, and excellent adhesion

Active Publication Date: 2018-06-08
DAICEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is a problem that the wax-type adhesive has a low softening point. Therefore, in a high-temperature process such as film attachment by vapor deposition or transfer from a temporarily fixed substrate to a wafer for lamination, the adhesive will flow. Fixing the wafer becomes difficult
In addition, it is also known to use a temperature-sensitive adhesive containing a pressure-sensitive adhesive and a side-chain crystalline polymer (Patent Documents 2 and 3), which also have problems of adhesive flow and wafer fixation during high-temperature processes. difficult problems
In addition, there is also known a method of curing, shrinking, and deforming the adhesive from the wafer by irradiating it with ultraviolet rays, but there is a problem that the wafer is easily broken due to the stress at the time of peeling.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12、 comparative example 1

[0238] Each component was added and mixed according to the formulation (unit: part by weight) described in the following table|surface, and the adhesive agent was prepared. Using the obtained adhesive, the following evaluations were performed.

[0239]

[0240] 1. Softness

[0241] 1-1: Whether natural peeling due to cooling occurs

[0242] On a silicon wafer (φ4 inches), 0.1 g of the adhesive was applied to a thickness of 10 μm. Thereafter, the silicon wafer was cut into a size of 1.5 cm x 1.5 cm, stacked on a glass plate of the same size, heated at 140° C. for 2 minutes, then heated at 200° C. for 2 minutes, and further carried out at 230° C. for 4 minutes. By heat treatment, a laminated body [silicon wafer / adhesive / glass plate] is obtained. After leaving the obtained laminate at 25° C. for 0.5 hours, whether or not natural peeling occurred between the silicon wafer and the glass plate was observed with the naked eye, and evaluated according to the following criteria. ...

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Abstract

Provided is an adhesive enabling: adhesion and fixing of an adherend onto a support while maintaining a high adhesive property during when the adherend is required to be fixed onto the support, even in a high temperature environment or an environment in which the temperature changes rapidly; detachment of, when the fixing has become unnecessary, the adherend from the support without causing any damage to the adherend; and easy removal of any residual paste present on the adherend after detachment. The adhesive according to the present invention contains a multivalent vinyl ether compound (A),a compound (B) having two or more constitutional units represented by formula (b), and a thermoplastic resin (C). In the formula, X represents a hydroxy group or a carboxy group.

Description

technical field [0001] The present invention relates to an adhesive for temporarily fixing adherends such as semiconductor wafers. This application claims the priority of Japanese Patent Application No. 2015-200836 for which it applied in Japan on October 9, 2015, and uses the content here. Background technique [0002] Miniaturization, thinning, and three-dimensional integration of semiconductor chips are being carried out in order to achieve miniaturization in size and weight, high functionality, and efficiency in power consumption. Such a semiconductor chip is manufactured by forming a circuit pattern on a wafer, grinding and thinning, and then dicing. However, since the thinned wafer is very fragile, it is easily broken during processing such as grinding and dicing, during transportation, and the like. Therefore, the wafer is processed and transported in a protected state by temporarily fixing the wafer to the support. [0003] Conventionally, wax-type adhesives are u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J5/00C09J11/06C09J11/08C09J201/06H01L21/304
CPCC09J4/06C09J11/08C09J201/06H01L21/304C09J5/06C09J2203/326C09J2400/22C09J7/30C09J11/06C09J2301/502C09J129/14C09J167/00C09J2467/00C09J2477/00C09J177/00C09J129/10C09J175/00C09J2475/00C08J5/18C08J2300/22C08J2329/14C08J2367/00C08J2375/04C08J2377/00C08L29/10
Inventor 小妻宏祯田中洋己
Owner DAICEL CORP
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