Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Rigid-flexible combined I/O modular device

A rigid-flexible, modular technology, applied in the structural connection of printed circuits, chassis/cabinet/drawer components, electrical equipment enclosures/cabinet/drawer, etc. requirements, poor product electromagnetic compatibility, etc., to achieve the effect of improving assembly process, improving product reliability, and high-reliability connection

Inactive Publication Date: 2018-06-12
CHINA NORTH VEHICLE RES INST
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Independently installed I / O ports cannot meet the requirements of modern systems for modularized, fast plug-in and interchange of electronic equipment, and numerous cables will also lead to poor electromagnetic compatibility of products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Rigid-flexible combined I/O modular device
  • Rigid-flexible combined I/O modular device
  • Rigid-flexible combined I/O modular device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to better understand the present invention, the technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] Such as Figure 1 to Figure 3 As shown, the rigid-flexible I / O port modular device provided by the present invention includes: a rigid-flexible I / O module assembly and a box assembly 1; the rigid-flexible I / O module assembly It includes: a panel 11, an I / O port backplane assembly 4, an adapter board assembly 6, and a motherboard assembly 5 connected to the lower end of the adapter board assembly 6 arranged in sequence, and the adapter board assembly 6 is connected to the motherboard The connecting plate between the plate assemblies 5 is a flexible connecting plate; the box assembly 1 includes: a box body 7, an upper cover 8 and a lower cover 9 respectively arranged on the upper and lower sides of the box body 7; The inner side of the cover 9 is provided with a guide rail 17...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a rigid-flexible combined I / O modular device, comprising: a rigid-flexible combined I / O module assembly and a box assembly; and the rigid-flexible combined I / O module assemblycomprises: a panel, an I / O port backboard assembly, an adapter board assembly, and a motherboard assembly connected to the lower end of the adapter board assembly in sequence, wherein a connection board between the adapter board assembly and the motherboard assembly is a flexible connection board. The rigid-flexible combined I / O modular device provided by the present invention achieves communication between the adapter board assembly and the motherboard assembly through the flexible connection board, thereby improving the assembly processability, realizing modular and high-reliability connection, and improving system reliability, signal integrity, and device electromagnetic compatibility.

Description

technical field [0001] The invention relates to a modular device, in particular to a rigid-flexible I / O modular device. Background technique [0002] In modern armored electronic equipment, a large number of I / O ports are used to realize communication with other equipment and internal functional modules. The traditional installation method is to install multiple I / O ports independently, and connect them to the motherboard through welding wires or rectangular connectors to realize the communication between the I / O ports and each module. Independently installed I / O ports cannot meet the requirements of modern systems for modular, fast plug-in and interchange of electronic equipment, and numerous cables will also lead to poor electromagnetic compatibility of products. [0003] At present, rigid-flexible boards have become the new mainstream design, and the emergence of flexible PCB boards has solved various problems caused by wire connections. Using a flexible PCB between two...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K5/02H01R12/59
CPCH01R12/59H05K1/147H05K5/0247H05K2201/10189
Inventor 林青郝宏王坤纪超林灿魏敏倪菊艳刘倩周婧王艳永林桔秋朱琳
Owner CHINA NORTH VEHICLE RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com