Packaging method and display screen

A packaging method and interlayer insulating layer technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of easy cracking and service life of display screens

Active Publication Date: 2019-09-17
TRULY HUIZHOU SMART DISPLAY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to provide a packaging method and a display screen for the problems that the packaging of the display screen is easy to crack and has a low service life.

Method used

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  • Packaging method and display screen
  • Packaging method and display screen
  • Packaging method and display screen

Examples

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Embodiment Construction

[0043] In order to facilitate the understanding of the present invention, the encapsulation method and the display screen will be more fully described below with reference to the relevant drawings. The preferred embodiment of the packaging method and the display screen is given in the accompanying drawings. However, the packaging method and the display screen can be implemented in many different forms, and are not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the packaging method and the display screen more thorough and comprehensive.

[0044] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The ter...

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Abstract

The invention involves a packaging method and display.The above packaging methods include: forming the buffer layer and semiconductor membrane layer on the substrate; prepare the first metal insulation combination structure layer, the first metal insulation combination structure layer includes the first layer insulation layer and the first metal membrane layer layer; The use of the imaging process and the drying method of the dry method to etch the first metal insulation combination structure layer to form the first metal layer pattern. The first metal layer pattern has multiple grids.Matrix type distribution; prepare a second metal insulation combination structure layer, the second layer insulation layer includes at least one layer of anti -hydraulic liquid etching layer; using the imaging process and dry etching process to etch the second metal insulation combination structure layer; Multiple convex structures and the side wall grooves on the insulation layer of the third layer together form an embedded defense separation structure to ensure that the sintering layer is encapsulated by ordinary sintering materials to achieve the predetermined adhesion.High -adhesive sintering material solves the problem of cracking and low service life of the packaging of the display screen.

Description

technical field [0001] The invention relates to the technical field of display screen manufacture, in particular to a packaging method and a display screen. Background technique [0002] With the rapid development of science and technology, high utilization rate has become an inevitable trend in the development of display screens. In order to increase the effective display area of ​​the display screen, the display screen reduces the frame width of the display screen as much as possible while pursuing a large-screen display. [0003] Since the display screen is packaged by sintering packaging method, in order to increase the effective display area of ​​the display screen, the area used for sintering packaging on the display screen is gradually reduced, which in turn increases the insufficient bonding degree of the display screen package and the risk of package failure . Although the traditional sintered packaging uses sintered materials with higher adhesion to improve the b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L27/15
CPCH01L27/15H10K71/00
Inventor 刘世奇铃木浩司任思雨苏君海李建华
Owner TRULY HUIZHOU SMART DISPLAY
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