Non-evaporable thin-film getter with controllable activation temperature and its application
A technology for activating temperature and getter, applied in electrical components, fluid velocity measurement, gaseous chemical plating, etc., can solve the problems of limiting the service life of components and maintaining the vacuum degree of the cavity, so as to prolong the service life and maintain the vacuum degree, increase the effect of inspiratory volume
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Embodiment 1
[0046] Such as figure 1 As shown, a non-evaporable thin film getter with controllable activation temperature of the present invention includes a first thin film getter layer 301 and a temperature control layer 302 . Wherein, the first thin film getter layer 301 has a porous structure, and the temperature control layer 302 has a dense structure. The double-layer thin film structure of the non-evaporative thin film getter needs to be continuously deposited under the condition of not breaking the vacuum of the cavity, so as to prevent the formation of a natural oxide layer after the thin film getter contacts with air. Its specific production process is as follows:
[0047] (1) After photolithography, use ICP (Inductively Coupled Plasma, Inductively Coupled Plasma) to etch the cavity on the wafer, where the wafer is SiO 2 and Si multilayer materials (SiO 2 / Si).
[0048] (2) The sealing ring is deposited by electrochemical deposition and metal lift-off process after photolitho...
Embodiment 2
[0052] Such as figure 2 As shown, a non-evaporable thin film getter with controllable activation temperature of the present invention includes a first thin film getter layer 301, a temperature control layer 302, a second thin film getter layer arranged in sequence from bottom to top 305 and getter protective layer 303; wherein, the first thin film getter layer 301 is a porous structure, the temperature control layer 302 is a dense structure, and the second thin film getter layer 305 is a dense structure; the getter protection Layer 303 is a dense structure. The four-layer thin film structure of the non-evaporative thin film getter needs to be continuously deposited under the condition of not breaking the vacuum of the cavity, so as to prevent the formation of a natural oxide layer after the thin film getter contacts with air. Its specific production process is as follows:
[0053] (1) After photolithography, use ICP to etch the cavity on the wafer, where the wafer is SiO 2...
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