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Bending-resistant wire

A bending-resistant and wire-resistant technology, applied in bendable conductors, bendable cables, conductors, etc., can solve the problems of poor mechanical properties of wires, easily broken conductors, and easily broken protective layers, and achieve good bending fatigue resistance. , not easy to break, good bulletproof effect

Pending Publication Date: 2018-07-10
SHENZHEN LEADERMENT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the wires of existing electronic equipment have poor mechanical properties, short service life, easy breakage of conductors, and easy rupture of the protective layer. long bend resistant wire

Method used

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Embodiment 1

[0025] This embodiment provides a bending-resistant wire, which is used to transmit power or data signals in electronic equipment sinks, such as Figure 1-2 As shown, the bending-resistant wire includes a copper wire 1, and the copper wire 1 includes an ultra-high molecular weight polyethylene fiber wire 11 and a copper foil layer 12 wound on the surface of the ultra-high molecular weight polyethylene fiber wire 11, The surface of the copper foil wire layer 12 is also wound with a copper wire layer 13, the copper wire layer 13 plays the role of signal transmission, and the copper foil wire is one or more, and is wound around the On the surface of the ultra-high molecular weight polyethylene fiber wire 11 , the diameter of the ultra-high molecular weight polyethylene fiber wire 11 is 0.3 mm, and there are one or more copper wires, which are wound on the surface of the copper foil wire layer 12 .

[0026] The bending resistance of the copper wire 1 filled with ultra-high molecul...

Embodiment 2

[0031] This embodiment provides a bending-resistant wire, which is used to transmit power or data signals in electronic equipment sinks, such as Figure 1-2 As shown, the bending-resistant wire includes a copper wire 1, and the copper wire 1 includes an ultra-high molecular weight polyethylene fiber wire 11 and a copper foil layer 12 wound on the surface of the ultra-high molecular weight polyethylene fiber wire 11, The surface of the copper foil wire layer 12 is also wound with a copper wire layer 13, the copper wire layer 13 plays the role of signal transmission, and the copper foil wire is one or more, and is wound around the On the surface of the ultra-high molecular weight polyethylene fiber wire 11 , the diameter of the ultra-high molecular weight polyethylene fiber wire 11 is 0.1 mm, and the copper wire is also one or more, which are wound and arranged on the surface of the copper foil wire layer 12 .

[0032] The bending resistance of the copper wire 1 filled with ultr...

Embodiment 3

[0037] This embodiment provides a bending-resistant wire, which is used to transmit power or data signals in electronic equipment sinks, such as Figure 1-2 As shown, the bending-resistant wire includes a copper wire 1, and the copper wire 1 includes an ultra-high molecular weight polyethylene fiber wire 11 and a copper foil layer 12 wound on the surface of the ultra-high molecular weight polyethylene fiber wire 11, The surface of the copper foil wire layer 12 is also wound with a copper wire layer 13, the copper wire layer 13 plays the role of signal transmission, and the copper foil wire is one or more, and is wound around the On the surface of the ultra-high molecular weight polyethylene fiber wire 11 , the diameter of the ultra-high molecular weight polyethylene fiber wire 11 is 0.8 mm, and the copper wire is also one or more, which are wound and arranged on the surface of the copper foil wire layer 12 .

[0038] The bending resistance of the copper wire 1 filled with ultr...

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Abstract

The invention discloses a bending-resistant wire comprising a copper wire. The copper wire comprises an ultrahigh molecular weight polyethylene fiber wire and a copper foil wire layer which is wound on the surface of the ultrahigh molecular weight polyethylene fiber wire. A copper wire layer is also wound on the surface of the copper foil wire layer. The ultrahigh molecular weight polyethylene fiber wire has the advantage of softness and has great bulletproof effect better than that of the aramid fiber, and the strength is higher than that of the Kevlar material for about 40% and doubles thatof the carbon fiber so as to be the fiber of the highest strength and have great bending fatigue. The specific bullet load value of the ultrahigh molecular weight polyethylene fiber wire can be ten times of that of the steel material and over two times of that of the glass fiber and aramid, the degree of bending resistance of the copper wire filled with the ultrahigh molecular weight polyethylenefiber wire is greatly enhanced, the copper foil wire is wound outside the ultrahigh molecular weight polyethylene fiber wire and the wire is not liable to break after being bent by external force so that the service life of the wire can be greatly prolonged.

Description

technical field [0001] The invention relates to a wire rod, in particular to a bending-resistant wire rod. Background technique [0002] With the rise of electronic equipment, the energy and signal transmission of electronic equipment, especially the demand for large-capacity data transmission between electronic equipment, is increasing. At present, both energy transmission and signal transmission often require wires to be realized. A wire refers to an item used to transmit electricity or information from one place to another. It is made of one or more mutually insulated conductive units wrapped with an insulating layer and a protective layer. [0003] Existing conductive and signal transmission wires mainly include a conductive bundle composed of multiple conductors and an insulating layer covering the conductive bundle. The conductive bundle is mainly made of copper wire, aluminum wire and other metal wires. Since the conductive bundle of the current wire is composed of s...

Claims

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Application Information

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IPC IPC(8): H01B7/04H01B7/17H01B7/22
CPCH01B7/04H01B7/17H01B7/22H01B7/18
Inventor 韦波张洪华
Owner SHENZHEN LEADERMENT TECH
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