Filter Package Components
A technology for packaging components and filters, applied to electrical components, impedance networks, etc., can solve problems such as film cracks and differences in thermal expansion coefficients
Active Publication Date: 2021-07-09
ZHUHAI CRYSTAL RESONANCE TECH CO LTD
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Problems solved by technology
Even so, there is still a large difference in the coefficient of thermal expansion (CTE) between the AlGaN film and the silicon substrate, which may cause the epitaxial layer to bear tension at room temperature, and these residual pressures may cause cracks in the film
Method used
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[0196] combine figure 1 and manufacturing process Figure 8 , the design details of the composite FBAR filter module will be described in detail. It is composed of several single crystal piezoelectric resonators, and the piezoelectric material is Ba x Sr (1-x) TiO 3 (BST), AlN or Al x Ga (1-x) N.
[0197] figure 1 A schematic diagram of the composite FBAR filter module 5 is shown. The filter module 5 is composed of a plurality of composite FBAR resonators arranged and combined in half-ladder type, half-lattice type or combination type. The composite FBAR resonator contains the constituent material Ba x Sr (1-x) TiO 3 (BST), AlN, Al x Ga (1-x) N or Sc x Al (1-x) N piezoelectric thin films 18', 18", which are formed by SiO2, Si 3 N 4 , Ta 2 O 5 , polyimide or benzocyclobutene (BCB) insulating material 54 is separated and sandwiched by the two electrodes 22 , 60 .
[0198] Sc x Al (1-x) N piezoelectric films 18', 18" are typically C-axis oriented and typical...
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Abstract
A filter package component comprising: a set of piezoelectric films comprising a series of mixed single crystals, each mixed single crystal comprising doped aluminum nitride sandwiched between a series of lower electrodes and a series of upper electrodes, wherein the upper The electrode includes a metal layer and a silicon film above the metal layer, and a cavity is formed above the silicon film; wherein, a series of lower electrodes are connected to an adapter plate, and a first cavity is formed between the series of lower electrodes and the adapter plate; wherein , a series of silicon films having a predetermined thickness are combined above a series of upper electrodes together with a series of upper cavities, each of which is located between one of the series of silicon films and a common silicon cover, and Align with the silicon film, upper electrode, and piezoelectric film below it, and the upper cavity is surrounded by side walls including silicon dioxide; wherein, each piezoelectric film, its upper electrode, and the silicon film above are insulated The material is separated from the adjacent piezoelectric film, top electrode, and silicon membrane.
Description
technical field [0001] The present invention relates to filter packaging components. Background technique [0002] Mobile phone users require high-quality signal reception and transmission over a wider area, and the quality of radio frequency (RF) signals depends on the RF filters in the mobile phone. Each RF filter conducts certain frequencies and blocks other unwanted frequencies, a feature that enables band selection and allows the phone to process only certain signals specified. [0003] It is believed that by 2020, technologies such as carrier aggregation, 5G, and 4x4 MIMO will become mainstream applications. By then, the number of filters in mobile phones will increase to as many as 100, and the annual global filter market demand will reach 200 billion. [0004] Acoustic resonators are the basic components of RF filters and sensors, and typically contain piezoelectric electromechanical transduction layers that convert mechanical energy into electrical energy. These r...
Claims
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IPC IPC(8): H03H3/02H03H9/05H03H9/17H03H9/58
CPCH03H3/02H03H9/0547H03H9/172H03H9/586H03H9/0523H03H9/587H03H9/588H03H9/605H03H2003/021H03H2003/023H03H9/02015H03H9/174
Inventor 不公告发明人
Owner ZHUHAI CRYSTAL RESONANCE TECH CO LTD