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Preparation technology and application thereof for phosphorus containing phenolic resin

A preparation process and technology of phenolic resin, which is applied in the field of preparation process of phosphorus-containing phenolic resin, can solve the problem of high cost, and achieve the effect of low cost and simple synthesis

Inactive Publication Date: 2018-07-13
NANJING YUANSHU MEDICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Phosphorus-containing epoxy resin uses DOPO as the main flame retardant, and multifunctional heat-resistant novolak epoxy resin as the main resin (such as phenol novolac epoxy resin, o-cresol novolac epoxy resin, phenol-benzaldehyde epoxy resin, etc.) Synthetic polymerization to prepare phosphorus-containing epoxy resin with a phosphorus content of 3±0.5% and an epoxy value of 0.3±0.3%. The phosphorus-containing epoxy resin of Dainippon Ink uses phenylphosphoric acid instead of DOPO to react to obtain a phosphorus-containing epoxy resin. As the current mainstream technology of halogen-free flame retardant, the phosphorus-containing epoxy resin prepared by the above process meets most of the requirements of halogen-free flame retardant of copper clad laminates, but the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1: Add 200 grams of diphenylphosphorus, 200 grams of phenol-type phenolic resin, and 1 gram of triphenylphosphorus under nitrogen protection conditions in a 2-liter reactor. After stirring for 13 hours at 120 degrees, cool to room temperature to obtain The amount of phosphorus was 7.5% phenol-type phenolic resin 1, and 401 g of the product was obtained, and the yield was 100%.

Embodiment 2

[0018] Example 2: 200 grams of diphenylphosphorus, 400 grams of phenol-type phenolic resin, and 1 gram of triphenylphosphorus were added to a 2-liter reactor. Phosphorus content is 5% phenol-type phenolic resin 2, obtains product 601g, and yield is 100%.

Embodiment 3

[0019] Example 3: Add 200 grams of diphenylphosphorus, 600 grams of phenol-type phenolic resin, and 1 gram of triphenylphosphorus under nitrogen protection conditions in a 2-liter reactor. After stirring for 13 hours at 120 degrees, cool to room temperature, and obtain The amount of phosphorus is 3.75% phenol-type phenolic resin 3, and the product 801g is obtained, and the yield is: 100%.

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PUM

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Abstract

The invention discloses a preparation technology and an application thereof for phosphorus containing phenolic resin. Diphenylphosphine oxide and derivative thereof are taken as a fire retardant; under a heating condition, the diphenylphosphine oxide and phenolic resin react to generate corresponding the phosphorus containing phenolic resin under a heating condition; the phenolic resin is taken asphenol type phenolic resin or bisphenol A phenolic resin. After the phosphorus containing phenolic resin prepared with the preparation technology is applied to produce a copper-clad plate, the flameretardant property reaches a V0 level.

Description

technical field [0001] The invention relates to the technical field of synthesis of polymer materials, in particular to a preparation process and application of phosphorus-containing phenolic resin. Background technique [0002] At present, the mainstream technical route of halogen-free flame retardant copper clad laminates is to use phosphorus-containing epoxy resins, nitrogen-containing phenolic resins and other flame-retardant resins in the preparation of halogen-free FR-4 copper-clad laminates, supplemented by curing agents such as dihydroamine and phenolic resins, Add inorganic flame retardants such as aluminum hydroxide, and press it into a copper clad laminate after curing and molding. [0003] Phosphorus-containing epoxy resin uses DOPO as the main flame retardant, and multifunctional heat-resistant novolak epoxy resin as the main resin (such as phenol novolac epoxy resin, o-cresol novolac epoxy resin, phenol-benzaldehyde epoxy resin, etc.) Polymerization to prepare...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/28C08L61/14
Inventor 金峰陆炜烨倪明明王凯
Owner NANJING YUANSHU MEDICAL TECH CO LTD
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