Heat transport device and projector

Abstract

A heat transport device which reduces the startup time of a loop heat pipe, and a projector having a heat transport device are provided. A heat transport device includes a loop heat pipe configured inthe form of a loop, and a control unit configured to control an amount of heat generated by a heat generating part when the loop heat pipe starts up. The loop heat pipe includes an evaporating unit configured to receive heat of a heat generating part as a cooling target and evaporate a hydraulic fluid, a condensing unit configured to radiate heat and condense vapor obtained by evaporation of thehydraulic fluid, a vapor pipe which connects the evaporating unit and the condensing unit to each other, and a liquid pipe which connects the condensing unit and the evaporating unit to each other.

Description

technical field [0001] The invention relates to a heat delivery device and a projector having a heat delivery device. Background technique [0002] Conventionally, loop-type heat pipes are known as cooling devices used in various electronic devices. The loop type heat pipe includes: an evaporating part that evaporates the working fluid by heat from a heating element; a condensing part that radiates heat from the evaporated working fluid to condense the steam; and a steam pipe and a liquid pipe that connect the evaporating part It is connected with the condensation part to form a loop. In such a loop-type heat pipe, since the cooling cycle is not established until the working fluid present in the steam flow path in the evaporator is completely evaporated, it takes time to start up. [0003] Patent Document 1 discloses a technology for shortening the start-up time of a loop-type heat pipe by providing a temperature difference between a steam pipe and a liquid pipe. Furtherm...

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Problems solved by technology

[0006] However, in Patent Document 1, there are problems such as that a heat storage material is required in addition to the loop-type heat pipe, and it is difficult to cope with a variable calorific value.

Also, in Patent Document 2, the heating device is used to heat the steam pipe to prevent condensation in the steam pipe. Although this technique contributes to the stable operation of the loop-type heat pipe, it is not ideal in terms of shortening the start-up start time.

[0007] In addition, when the start-up of the loop-type heat pipe takes time, there is a problem that the heat generation temperature of the electronic component to be cooled is overshooted.

In addition, there is a problem that the loop type heat pipe does not start up when the amount of heat generated by the electronic component is small, or when the influence of heat leakage is large.

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