Vacuum glass sealing low-melting-point glass powder and anodic bonding enhanced packaging method

A technology of low melting point glass and vacuum glass, which is applied in the application of anodic bonding enhanced encapsulation method and the preparation of low melting point glass powder for vacuum glass sealing, can solve the problem of high working temperature, achieve low working temperature and reduce production cost , The effect of improving the sealing strength

Active Publication Date: 2018-07-20
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The Low-E film used in vacuum glass needs to be used at a temperature lower than 4...

Method used

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  • Vacuum glass sealing low-melting-point glass powder and anodic bonding enhanced packaging method
  • Vacuum glass sealing low-melting-point glass powder and anodic bonding enhanced packaging method
  • Vacuum glass sealing low-melting-point glass powder and anodic bonding enhanced packaging method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A low-melting-point glass frit for vacuum glass sealing and an anodic bonding enhanced sealing method thereof, comprising laminating a glass substrate provided with a low-melting-point glass coating on the surface with another glass substrate of vacuum glass for anodic bonding package, in which the thermal expansion coefficient of the low melting point glass coating matches the glass substrate; the specific packaging steps are as follows:

[0044] 1) Low melting point glass powder ingredients

[0045] Weigh the basic glass raw material by mass percentage: V 2 o 5 70%, P 2 o 5 19%, TeO 2 5%, B 2 o 3 2%, ZnO 1.5%, Na 2 O is 2.5%, and the raw materials weighed are fully mixed to make a mixture.

[0046]

[0047] 2) Preparation of low melting point glass powder

[0048] The obtained glass batches were heated up to 1200°C at a rate of 3-5°C / min, and then held for 2 hours; then poured into a graphite mold for molding, and annealed at 330°C for 1 hour, and the prep...

Embodiment 2

[0056] A low-melting-point glass frit for vacuum glass sealing and an anodic bonding enhanced sealing method thereof, comprising laminating a glass substrate provided with a low-melting-point glass coating on the surface with another glass substrate of vacuum glass for anodic bonding package, in which the thermal expansion coefficient of the low melting point glass coating matches the glass substrate; the specific packaging steps are as follows:

[0057] 1) Low melting point glass powder ingredients

[0058] Weigh the basic glass raw material by mass percentage: V 2 o 5 64%, P 2 o 5 25%, TeO 2 5%, B 2 o 3 2%, ZnO 1.5%, Na 2 O is 2.5%, and the raw materials weighed are fully mixed to make a mixture.

[0059]

[0060] 2) Preparation of low melting point glass powder

[0061] The obtained glass batches were heated up to 1200°C at a rate of 3-5°C / min, and then held for 2 hours; then poured into a graphite mold for molding, and annealed at 330°C for 1 hour, and the prep...

Embodiment 3

[0069] A low-melting-point glass frit for vacuum glass sealing and an anodic bonding enhanced sealing method thereof, comprising laminating a glass substrate provided with a low-melting-point glass coating on the surface with another glass substrate of vacuum glass for anodic bonding package, in which the thermal expansion coefficient of the low melting point glass coating matches the glass substrate; the specific packaging steps are as follows:

[0070] 1) Low melting point glass powder ingredients

[0071] Weigh the basic glass raw material by mass percentage: V 2 o 5 59%, P 2 o 5 25%, TeO 2 5%, B 2 o 3 2%, ZnO 6.5%, Na 2 O is 2.5%, and the raw materials weighed are fully mixed to make a mixture.

[0072]

[0073] 2) Preparation of low melting point glass powder

[0074] The obtained glass batches were heated up to 1200°C at a rate of 3-5°C / min, and then held for 2 hours; then poured into a graphite mold for molding, and annealed at 330°C for 1 hour, and the prep...

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Abstract

The invention relates to the technical field of vacuum glass manufacturing, in particular to a vacuum glass sealing material and an anodic bonding enhanced sealing method thereof. An adopted edge sealing material is lead-free low-melting-point glass powder, and the glass powder is characterized by being low in sealing temperature and adjustable in thermal expansion coefficient, the requirements for low temperature sealing can be met, and the anodic bonding is used to enhance the vacuum glass sealing to achieve a low temperature sealing process. The lead-free low-melting-point glass powder is fully melted and does not crack during the sintering process at 300-450 DEG C, and forms a good infiltration with substrate; and at the same time, an anodic bonding sealing technology is used to further lower the sealing temperature and improve the sealing strength and quality. A new technical scheme is provided for vacuum glass edge sealing, a vacuum glass sealing process is improved, and a new solution is provided for preparing the vacuum glass excellent in performance.

Description

technical field [0001] The invention belongs to the field of vacuum glass manufacturing, and in particular relates to the preparation of a low-melting-point glass powder for vacuum glass sealing and the application of an anode bonding enhanced packaging method. Background technique [0002] In 1989, R.E. Collins, a professor at the University of Sydney, cooperated with Tang Jianzheng, a former professor of physics at Peking University, to successfully develop vacuum glass for the first time. Subsequently, Nippon Sheet Glass Co., Ltd. (NSG) obtained the patent right of vacuum glass from the University of Sydney, established the world's first vacuum glass production line in Kyoto, Japan, and realized the industrialization of vacuum glass. In 1998, Professor Tang Jianzheng returned to China and started the research and development of vacuum glass in my country. Subsequently, Beijing Xinliji Vacuum Glass Technology Co., Ltd. was established, becoming the second enterprise in th...

Claims

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Application Information

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IPC IPC(8): C03C8/24C03C27/10
CPCC03C8/24C03C27/10
Inventor 李宏张平卓永
Owner WUHAN UNIV OF TECH
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