Unlock instant, AI-driven research and patent intelligence for your innovation.

Tunneling Field Effect Transistor and Manufacturing Method Thereof

A tunneling field effect and transistor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of small point tunneling turn-on voltage, increased sub-threshold swing, and slow change, etc. Effects of small dot tunneling current, increased tunneling path length, and reduced subthreshold swing

Active Publication Date: 2021-02-23
HUAWEI TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the small doping concentration in the channel, a larger energy band bending than the gate-source overlap region will occur under a certain gate bias voltage, so there is a small gate voltage between the source region and the channel The energy bands overlap, resulting in band-to-band tunneling (called point tunneling)
Although the point tunneling current is small, the turn-on voltage of point tunneling is smaller, which will cause the tunneling current of the TFET in the subthreshold region to change slowly with the gate voltage, resulting in an increase in the subthreshold swing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tunneling Field Effect Transistor and Manufacturing Method Thereof
  • Tunneling Field Effect Transistor and Manufacturing Method Thereof
  • Tunneling Field Effect Transistor and Manufacturing Method Thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0086] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0087] see figure 1 , figure 1 It is a cross-sectional view of a tunneling field effect transistor disclosed in an embodiment of the present invention. The tunneling field effect transistor 1 includes a substrate 10, a source region 20, a drain region 30, a channel 40, a pocket region 50, a gate stack layer 60, and a sidewall 70, wherein the source region 20, the drain region 30, the channel 40 , the pocket region 50 , the gate stack layer 60 , ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A tunneling field effect transistor and a manufacturing method thereof, the tunneling field effect transistor comprising a substrate (10); a source region (20) and a drain region (30) arranged on the substrate (10); the source region (20 ) and the drain region (30) is the channel (40), the source region (20) and the channel (40) form a pocket region (50), the source region (20) and the pocket region (50 ) contain the first type of dopant, the drain region (30) contains the second type of dopant; the gate stack layer (60), the gate stack layer (60) is arranged in the source region (20), the pocket region (50) And on the channel (40); sidewalls (70), the sidewalls (70) are arranged on both sides of the gate stack layer (60). The tunneling field effect transistor can reduce the subthreshold swing of the tunneling field effect transistor.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a tunneling field effect transistor and a manufacturing method thereof. Background technique [0002] As the size of Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) continues to shrink, power consumption and reliability of the device have become important factors restricting the development of integrated circuits. In order to reduce the power consumption of integrated circuits, Tunnel Field-Effect Transistor (TFET) has been extensively studied. In TFET, carriers are injected into the channel by the mechanism of interband tunneling, which can realize Smaller subthreshold swing (subthreshold swing refers to the amount of change in gate voltage required when the drain current of a transistor changes by an order of magnitude in the subthreshold state. The smaller the subthreshold swing, the drain current increases with the gate voltage. The faster the pole voltage ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/06H01L21/336
CPCH01L29/06
Inventor 徐挽杰蔡皓程张臣雄
Owner HUAWEI TECH CO LTD