Unlock instant, AI-driven research and patent intelligence for your innovation.

SMT (Surface Mounting Technology) low-temperature curing patching red gum for lead-free welding

A lead-free soldering and patch red technology is applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., which can solve the problems of increasing enterprise costs, adverse effects on performance, and high energy consumption, and achieve the effect of improving the bonding strength

Inactive Publication Date: 2018-08-14
苏州盛威佳鸿电子科技有限公司
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the miniaturization of electronic appliances, high temperature curing will adversely affect the performance of some components, and the energy consumption is also high, which increases the cost of the enterprise. Therefore, it is urgent to develop a patch red glue suitable for low temperature curing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Weighing: 20 kg of silicone modified epoxy resin, 16 kg of sorbitol polyglycidol, 6 kg of dithiosalicylic acid, 16 kg of fumed silica, 5 kg of silicon oxide, 1 kg of white carbon black and iron oxide Red 1.1 kilograms, make the low-temperature curing paster red glue of the present invention.

Embodiment 2

[0017] Weighing: 22 kg of silicone modified epoxy resin, 17 kg of sorbitol polyglycidol, 7 kg of dithiosalicylic acid, 18 kg of fumed silica, 6 kg of silicon oxide, 2 kg of white carbon black and iron oxide Red 1.3 kilograms, make the low-temperature curing patch red glue of the present invention.

Embodiment 3

[0019] Weighing: 25 kg of silicone modified epoxy resin, 18 kg of sorbitol polyglycidol, 8 kg of dithiosalicylic acid, 19 kg of fumed silica, 7 kg of silicon oxide, 3 kg of white carbon black and iron oxide Red 1.6 kilograms, make the low-temperature curing patch red glue of the present invention.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses SMT (Surface Mounting Technology) low-temperature curing patching red gum for lead-free welding. The SMT low-temperature curing patching red gum is prepared from the followingcomponents in parts by weight: 20-35 parts of organosilicon-modified epoxy resin, 16-25 parts of sorbitol polyglycidyl, 6-12 parts of dithio-salicylic acid, 16-25 parts of fused silicon dioxide, 5-12parts of silicon oxide, 1-6 parts of white carbon black and 1.1-2.2 parts of iron oxide red. The SMT low-temperature curing patching red gum for lead-free welding provided by the invention has the beneficial effects that the curing can be achieved in a shorter time under a low-temperature environment, and meanwhile the bonding strength is greatly improved.

Description

technical field [0001] The invention relates to the field of adhesives for electronics, in particular to a SMT low-temperature curing patch red adhesive used in lead-free soldering. Background technique [0002] Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so all kinds of electrical appliances need [0003] Various SMT patch adhesives are used for bonding. [0004] Most of the patch red glue on the market has a curing temperature of about 150°C, and a curing time ranging from 2 to 5 minutes. With the miniaturization of electronic appliances, high-temperature curing will adversely affect the performance of some components, and the energy consumption is also high, which increases the cost of the enterprise. Therefore, it is urgent to develop a patch red glue suitable for low-temperature curing. Contents of the invention [0005] Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
CPCC08K2003/2272C08K2201/014C08L2203/20C08L2205/025C09J11/04C09J11/06C09J163/00C08L63/00C08K13/02C08K5/375C08K3/36C08K3/22
Inventor 朱道田
Owner 苏州盛威佳鸿电子科技有限公司