Electronic integrated circuit chip sealing structure for automobile application
An integrated circuit and sealing structure technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems affecting the service life of circuit chips and unsatisfactory effects, so as to prevent high temperature from affecting device operation, improve service life, and eliminate static electricity Effect
Inactive Publication Date: 2018-08-21
DONGGUAN ZHIPEI ELECTROMECHANICAL TECH CO LTD
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Problems solved by technology
When the integrated chips used in automobiles buffer the electrostatic shock, the effect of eliminating static electricity is not ideal and cannot meet the requirements, which affects the service life of the circuit chip
Method used
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[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0019] The present invention provides such as Figure 1-3 The shown sealing structure of an electronic integrated circuit chip for automotive applications includes a mounting board 1, a main board 2 is provided on the top of the mounting board 1, an integrated chip 3 is provided on the top of the main board 2, and an integrated chip 3 is provided inside the integrated chip 3. The conductive plug 4 collects the static electricity on the surface of the integrate...
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The invention discloses an electronic integrated circuit chip sealing structure for automobile application. The sealing structure comprises a mounting plate, a main board is arranged on the top of themounting plate, an integrated chip is arranged on the top of the main board, conductive plugs are arranged inside the integrated chip, conductive strips are arranged at the tops of the conductive plugs, an electrostatic sheet is arranged at the tops of the conductive strips, a sealed outer casing is arranged at the top of the mounting plate, ion wind wand mounting bases are arranged on the two sides inside the sealed outer casing, and an ion wind wand is arranged between the two ion wind wand mounting bases. According to the sealing structure, through arrangement of the conductive plugs, theconductive strips, the electrostatic sheet and the ion wind wand, the electronic integrated chip is protected from the impact of static electricity, the device is prevented from being damaged, and theservice life of the device is prolonged; heat conducting rods, through holes, connecting bases and a heat sink strip are arranged to facilitate heat dissipation of the integrated chip, high temperature is prevented from affecting the running of the device, the damage on the device is avoided, and the service life of the device is prolonged.
Description
technical field [0001] The invention relates to the field of static electricity removal for integrated chips, in particular to an electronic integrated circuit chip sealing structure used in automobiles. Background technique [0002] Since the components of integrated circuits have been miniaturized to nanometer size, they are easily damaged by the impact of electrostatic discharge. In addition, some electronic products, such as notebook computers or mobile phones, are easier to make than before, thinner and shorter, and they are more resistant to electrostatic shocks. for lowering. For these electronic products, if no appropriate electrostatic protection device is used for protection, the electronic products are easily impacted by static electricity, causing system restarts of electronic products, and even hardware damage and irreversible problems. At present, all electronic products are required to pass the IEC61000-4-2 standard (the IEC61000-4-2 standard is a basic stand...
Claims
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IPC IPC(8): H01L23/367H01L23/58H01L23/60
CPCH01L23/367H01L23/58H01L23/60
Inventor 朱怀新
Owner DONGGUAN ZHIPEI ELECTROMECHANICAL TECH CO LTD