Multi-layer board integral hot pressing process

A hot-pressing process and multi-layer board technology, which is applied in decorative arts, painting tools, manufacturing tools, etc., can solve the problems of high price of solid wood boards, difficulty in mass promotion, unfavorable environmental protection, etc., and achieve good bonding effect and good release effect , the effect of reducing moisture content

Inactive Publication Date: 2018-08-24
天长市双丰文化用品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them: the price of solid wood board is high, and it is not conducive to environmental protection, so it is difficult to promote in large quantities; the price of MDF, particle board, sandwich board, etc. is relatively low, but the performance is much worse than that of solid wood

Method used

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  • Multi-layer board integral hot pressing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An overall hot pressing process for multilayer boards, including the following steps:

[0027] (1) Rotate the purchased logs into 5mm thick boards, spray the boards with clean water, spray once every other day, and place them in a cool and ventilated place to dry after spraying for a total of 5 days;

[0028] (2) Put the spray-treated board into the antiseptic solution for cooking, slowly heat it until the temperature of the antiseptic solution reaches 65 degrees, and keep it warm for 3 hours;

[0029] (3) After the cooking is completed, continue to immerse the board in the antiseptic solution to cool to room temperature, and then ultrasonically treat the antiseptic solution and the board with a processing power of 400W;

[0030] (4) Carry out hot air circulation drying treatment on the ultrasonically processed panels, and the drying temperature is 130 degrees, so that the moisture content of the dried panels is controlled at 8%;

[0031] (5) Pass the dried plate through the gap ...

Embodiment 2

[0042] An overall hot pressing process for multilayer boards, including the following steps:

[0043] (1) Rotary cut the purchased logs into 4mm thick boards, spray the boards with clean water, spray every other day, and dry them in a cool and ventilated place for a total of 6 days after spraying;

[0044] (2) Put the spray-treated board into the antiseptic solution for cooking, slowly heat it to the temperature of the antiseptic solution to 68 degrees, and keep it warm for 4 hours;

[0045] (3) After the cooking is completed, continue to soak the board in the antiseptic solution to cool to room temperature, and then ultrasonically treat the antiseptic solution and the board with a processing power of 500W;

[0046] (4) Carry out hot air circulation drying treatment on the ultrasonically processed panels, the drying temperature is 140 degrees, so that the moisture content of the panels after drying is controlled at 12%;

[0047] (5) Pass the dried plate through the gap between the disch...

Embodiment 3

[0058] An overall hot pressing process for multilayer boards, including the following steps:

[0059] (1) Rotary cut the purchased logs into 3mm thick boards, spray the boards with clean water, spray once every other day, and put them in a cool and ventilated place to dry after spraying for a total of 6 days;

[0060] (2) Put the spray-treated board into the antiseptic solution for cooking, slowly heat it to the temperature of the antiseptic solution to 70 degrees, keep it warm and cook for 5 hours;

[0061] (3) After the cooking is completed, continue to soak the board in the antiseptic solution to cool to room temperature, and then ultrasonically treat the antiseptic solution and the board with an ultrasonic treatment power of 600W;

[0062] (4) Carry out hot-air circulation drying treatment on the ultrasonically processed panels, and the drying temperature is 150 degrees, so that the moisture content of the dried panels is controlled at 14%;

[0063] (5) Pass the dried plate through ...

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Abstract

The invention relates to the technical field of wood processing, in particular to a multi-layer board integral hot pressing process. The method comprises the following steps that firstly, repeatedly spraying and airing is carried out on a wood board so that the water absorption expansion rate of the wood board can be effectively reduced, then the wood board can be effectively prevented from beingprone to absorb water and damaged after being made into a drawing board, and the ageing resistance of the board is enhanced; then the wood board is placed into an anti-corrosion liquid, so that the anti-corrosion effect of the wood board is enhanced, then the moisture content of the wood board is reduced through hot air circulation drying, and therefore the inner temperature and the outer temperature of the wood board are uniform and consistent, the moisture content of the wood board is reduced, and the firmness of the wood board is improved; and finally, the wood board is subjected to coronatreatment, so that the static property of the wood board is enhanced, the adhesion of the subsequent wood board is better, then the wood board is bonded through an adhesive, hot pressing and freezingtreatment are carried out, and then the prepared multi-layer board is good in bonding effect and high in firmness.

Description

Technical field: [0001] The invention relates to the technical field of drawing board processing, in particular to an integral hot pressing process of a multilayer board. Background technique: [0002] The drawing board is an indispensable tool for fixing the frame of art and calligraphy. When sketching and painting, it is often used to pad the tablet with drawing paper, and it is often placed on the drawing board. The drawing boards are mostly made of wood, and the wooden drawing boards have good texture and high artistic sense. Among them: solid wood boards are expensive, and are not conducive to environmental protection, and are difficult to promote in large quantities; MDF, particleboard, sandwich boards, etc. are relatively cheap, but their performance is much worse than that of solid wood. To balance the above factors, the current imitation solid wood process is adopted, such as the edge sealing process of multi-layer boards, the net material is opened after the multi-lay...

Claims

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Application Information

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IPC IPC(8): B27M3/00B44D3/18
CPCB27M3/00B44D3/18
Inventor 戴君德
Owner 天长市双丰文化用品有限公司
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