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Thermal control device

A thermal control and vacuum chamber technology, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of large occupied space and complex structure, achieve small occupied space, expand the scope of application, and realize long-distance transmission. Effect

Pending Publication Date: 2018-08-24
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a thermal control device, which can solve the problems of complex structure and large space occupation while ensuring the heat transfer performance of the thermal control device including the cold source and heat pipe

Method used

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Embodiment Construction

[0029] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

[0031] figure 1 A sche...

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PUM

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Abstract

The invention relates to the field of thermal control and discloses a thermal control device. The thermal control device comprises a cold source, a heat pipe device and a vacuum system. The heat pipedevice comprises a condenser, an evaporator and a connection pipe connecting the condenser with the evaporator, and the condenser is connected with the cold source. The vacuum system comprises a firstvacuum chamber and a vacuum sleeve pipe. At least part of the cold source and at least part of the condenser are located in the first vacuum chamber, the vacuum sleeve pipe is arranged outside the connection pipe in a sleeved manner, a gap is formed between the inner wall of the vacuum sleeve pipe and the outer wall of the connection pipe, and a vacuum environment is formed in the gap. Through the scheme of the vacuum sleeve pipe arranged outside the connection pipe in a sleeved manner, a heat-insulating vacuum system of the whole thermal control device is compact in structure, a huge vacuumhood and a cold screen are not needed, the external environmental heat leakage is greatly reduced, the whole thermal control device is small in occupied space, and the system is flexibly arranged moreconveniently.

Description

technical field [0001] The invention relates to the field of thermal control, in particular to a thermal control device. Background technique [0002] With the development of science and technology, low temperature application technology has been widely used and developed in many fields such as superconducting electronics, low temperature optics, aerospace and biomedicine. The current low-temperature cold sources mainly include low-temperature refrigerators and low-temperature liquid storage, etc., and the cooled device is usually directly contacted with the cold source for cooling. However, in many application environments, the mechanical vibration and electromagnetic interference of the cryogenic refrigerator will affect the performance of the cooled device, or some low-temperature system layouts require that the cooled device cannot be directly connected to the cold source, so it needs to be cooled at a low temperature. Flexible heat transfer or long-distance efficient h...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/02
Inventor 赵雅楠陈厚磊梁惊涛
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI