Pressure-free guide type double-copper-foil cutting forming system

Abstract

The invention discloses a pressure-free guide type double-copper-foil cutting forming system. At least one copper foil cutting and conveying mechanism is arranged on a rack at intervals in the longitudinal direction. Each copper foil cutting and conveying mechanism comprises a chuck, a first plane conveying device, a cutting mechanism and a second plane conveying device are sequentially arranged in the conveying direction of copper foil. Conveying driving devices drive the chucks for mounting copper foil coils on the rack. The copper foil on the copper foil coils is led out to the surfaces ofthe corresponding first plane conveying devices. The first plane conveying devices and the second plane conveying devices can conduct conveying in the conveying direction of the copper foil correspondingly. First air pressure supply devices and second air pressure supply devices are used for providing air pressure making close contact with the surfaces of the first plane conveying devices and thesecond plane conveying devices for the copper foil on the surfaces of the first plane conveying devices and the second plane conveying devices. The first plane conveying devices, the cutting mechanisms and the second plane conveying devices are aligned and connected in pairs. The copper foil getting into the cutting areas of the cutting mechanisms can be cut off through the cutting mechanisms. Thepressure-free guide type double-copper-foil cutting forming system can convey the copper foil without being pressed by guide wheels, and the phenomenon that the copper foil slips and gets wrinkled inthe conveying process is avoided.

Description

technical field [0001] The invention relates to a cutting and stacking system, in particular to a non-pressing and drawing double copper foil cutting and forming system. Background technique [0002] In the stacking part of the circuit board production line, the first process is uncoiling and cutting of the copper foil roll, cutting the copper foil to the required size for sandwich forming, and then lifting it to the combination table by the crane for stacking. Before the copper foil is cut, the take-up wheel driven by the servo motor (the take-up wheel is one up and one down, one glue and one steel, and the copper foil is pressed by the pressure of the cylinder) rotates to drive the copper foil to move towards the cutting knife, and the servo motor The extraction length is converted according to the diameter of the extraction wheel, and thus the length is controlled. [0003] At present, the thickness of copper foil commonly used in the PCB industry is 1 / 3OZ, 1 / 2OZ, 1OZ, (...

AI Technical Summary

Problems solved by technology

[0003] At present, the thickness of copper foil commonly used in the PCB industry is 1 / 3OZ, 1 / 2OZ, 1OZ, (1OZ=35um) and there is a tendency to develop towards a thinner 1 / 4OZ. The higher the stability requirement, the thickness of 1 / 3OZ copper foil is only 12um. When extracting 1 / 3OZ, it will cause slippage or wrinkle on the surface of copper foil due to the problem of the wheel, which will reduce the product yield. If the industry subsequently uses 1 / 4OZ copper foil, this problem will be more serious, and it is urgent to develop a new extraction method to adapt to market development

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