Abrasive material

A technology of abrasive particles and abrasive layers, applied in abrasives, electrical components, metal processing equipment, etc., can solve the problem of high grinding cost and achieve the effect of low grinding cost

Active Publication Date: 2018-08-31
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing free abrasive grain grinding and semi-fixed abrasive grain grinding must continuously supply the abrasive grains to the grinding material, and the grinding cost is high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0032] Hereinafter, a first embodiment of the present invention will be described in detail with appropriate reference to the drawings.

[0033]

[0034] Figure 1A and Figure 1B The abrasive material 1 shown is disc-shaped and mainly includes a base material 10 and an abrasive layer 20 laminated on the surface side of the base material 10 . In addition, the abrasive material 1 includes an adhesive layer 30 laminated on the back side of the base material 10 . The grinding material 1 is disposed on a grinding platen of a known grinding device, and is ground by the grinding device while rotating while contacting the object to be ground. That is, the grinding direction of the grinding material 1 is the circumferential direction of the substrate 10 .

[0035] (Substrate)

[0036] The base material 10 is a plate-shaped member for supporting the polishing layer 20 .

[0037] The material of the substrate 10 is not particularly limited, and examples include: polyethylene terep...

no. 2 Embodiment

[0093] Hereinafter, a second embodiment of the present invention will be described in detail with appropriate reference to the drawings.

[0094] figure 2 The abrasive material 2 shown is disk-shaped, and mainly includes a base material 11 and an abrasive layer 20 laminated on the surface side of the base material 11 . In addition, the abrasive material 2 includes an adhesive layer 30 laminated on the back side of the base material 11 . Furthermore, the abrasive material 2 includes a support 40 laminated via an adhesive layer 30 and a support adhesive layer 41 laminated on the back side of the support 40 . In addition, the same code|symbol is attached|subjected about the same component as 1st Example, and description is abbreviate|omitted.

[0095] (Substrate)

[0096] The substrate 11 is a plate-shaped member for supporting the polishing layer 20 . The substrate 11 is divided into a first region X1, a second region X2, a third region X3, and a fourth region X4 along the ...

Embodiment 1

[0133] Diamond abrasive grains were prepared, and the average particle diameter was measured using "Microtrac MT3300EXII" manufactured by Nikkiso Co., Ltd. The average particle size of the diamond abrasive grains is 44 μm. Furthermore, the type of diamond in the abrasive grains is treated diamond coated with 55% by mass nickel.

[0134] Sodium silicate (No. 3 sodium silicate) as binder, the diamond abrasive grains, and alumina (Al 2 o 3 , with an average particle size of 12 μm) were mixed and prepared so that the content of the diamond abrasive grains relative to the abrasive layer became 5 vol % and the content of the filler relative to the abrasive layer became 71 vol % to obtain a coating liquid.

[0135] A disc-shaped aluminum plate having an average thickness of 300 μm, an outer diameter of 386 mm, and an inner diameter of 148 mm was prepared as a base material. Divided into 8 regions by 4 straight lines passing through the center of the substrate surface and forming a...

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Abstract

The purpose of the present invention is to provide an abrasive material in which the polishing efficiency does not readily decrease and in which the polishing cost is relatively low. This abrasive material is provided with a substrate and a polishing layer which is laminated on the obverse-surface side of the substrate and which includes abrasive grains and a binder therefor, wherein: the polishing layer has, along the polishing direction, a plurality of types of regions which have provided on the surface thereof a plurality of polishing parts divided by grooves and in which the plurality of polishing parts have different occupancy area ratios; and the difference in occupancy area ratio of the plurality of polishing parts between a pair of the regions adjacent along the polishing directionis 3%-21%. Each of the regions may be of such size as to be capable of encompassing a circle having a diameter of 5 cm in plan view. With regard to a pair of regions adjacent along the polishing direction, the occupancy area ratio of the plurality of polishing parts in one of the pair of regions is preferably 4.5%-9% and the occupancy area ratio of the plurality of polishing parts in the other ofthe pair of regions is preferably 9%-16%.

Description

technical field [0001] The invention relates to a grinding material. Background technique [0002] In recent years, the precision of electronic devices such as hard disks has advanced. As a substrate material for such electronic devices, glass is often used in consideration of rigidity, impact resistance, and heat resistance that can cope with miniaturization or thinning. The glass substrate is a brittle material, and its mechanical strength is significantly impaired due to surface damage. Therefore, in polishing of such a substrate, planarization accuracy with a polishing rate and less damage is required. [0003] Generally, if it is desired to improve the planarization accuracy of the finishing process, the processing time tends to be prolonged, and the polishing rate and the planarization accuracy are in a trade-off relationship. Therefore, it is difficult to achieve both polishing rate and planarization accuracy. In contrast, there has been proposed an abrasive havin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D7/00B24D3/00B24D7/06B24D11/00B24D11/04H01L21/304
CPCB24D3/00B24D7/00B24D7/06B24D11/00B24D11/04H01L21/304
Inventor 西藤和夫岩永友树笹岛启佑田浦歳和
Owner BANDO CHEM IND LTD
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