The invention discloses a
semiconductor refrigerating module provided with
solid-state fans. The
semiconductor refrigerating module comprises
semiconductor refrigerating pieces and heat dissipation assemblies. The hot end faces and the cold end faces of the semiconductor refrigerating pieces are provided with the heat dissipation assemblies respectively. At least one heat dissipation
assembly is provided with the
solid-state fan. The invention further discloses a refrigerating container comprising the semiconductor refrigerating module. According to the semiconductor refrigerating module provided with the
solid-state fans and the refrigerating container comprising the semiconductor refrigerating module, the solid-state fans are based on the
corona discharge principle, mechanical movement components are omitted, and vibration and
noise caused by a
mechanical fan are avoided; meanwhile, the solid-state fans are low in working current and low in
power consumption, heat dissipation fin plates can be utilized directly to serve as collector electrodes, and therefore the overall size and weight of a heat dissipation
system are greatly reduced; in addition, the air speed can be changed by changing the
voltage applied to
discharge electrodes, the distance between the
discharge electrodes and an
electrode plate, and the distance between the discharge electrodes. The semiconductor refrigerating module provided with the solid-state fans and the refrigerating container comprising the semiconductor refrigerating module have the advantages that the structure is more compact and lighter, the operation process is free of vibration and
noise, the efficiency is higher, the air speed is easy to control, and design and optimization can be conducted with higher degree of freedom according to requirements.